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NB3N502DR2G

Onsemi

NB3N502DR2G by Onsemi

NB3N502DR2G clock generator by Onsemi operates at a max output frequency of 190 MHz with supply voltages of 3.3/5 V. This CMOS technology device is ideal for industrial applications requiring precise timing, featuring a small outline package and dual terminal position for easy integration in compact designs.

Median Price

$12.360

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,633 parts In-Stock

1+ parts

$6.220

100+ parts

$3.220

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$2.890

10k+ parts

$2.690

1,633

$6.220

$3.220

$2.890

$2.690

Chip1Stop

Japan . 862 parts In-Stock

1+ parts

$18.500

100+ parts

$8.160

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$6.180

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862

$18.500

$8.160

$6.180

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Distributors (In-Stock)

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Digiode

USA . 234 parts In-Stock

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$5.700

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$5.700

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Vyrian

USA . 2,024 parts In-Stock

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$6.000

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$6.000

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Component Electronics Inc.

Canada . 14 parts In-Stock

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$12.310

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$9.230

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$8.000

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14

$12.310

$9.230

$8.000

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Bristol Electronics

USA . 522 parts In-Stock

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,993 parts In-Stock

1+ parts

$5.290

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$5.290

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Corphita

USA . 2,261 parts In-Stock

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$5.400

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$5.400

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Component Stockers USA

USA . 3,431 parts In-Stock

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$5.630

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$4.140

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$2.980

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3,431

$5.630

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$2.980

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Corohmni

South Africa . 261 parts In-Stock

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$6.000

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261

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Perfect Parts

USA . 25,420 parts In-Stock

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Lixinc

USA . 16,177 parts In-Stock

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SupplyDigital Components

Austria . 7,353 parts In-Stock

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Microchip USA

USA . 5,973 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,487 parts In-Stock

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GreenTree Electronics

Israel . 4,962 parts In-Stock

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Kulean Microsystems

USA . 4,009 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,831 parts In-Stock

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Problanco Electronics

Mexico . 2,534 parts In-Stock

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Authorized Procurement Solutions

USA . 2,380 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Metaverse IC Inc.

Canada . 1,630 parts In-Stock

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TANS Electronics

Latvia . 1,264 parts In-Stock

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UHIMA Technologies

Türkiye . 848 parts In-Stock

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Continental Prestige Electronics

USA . 680 parts In-Stock

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$3.430

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Kepictronics

USA . 40 parts In-Stock

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Overview

Enhance your electronic designs with the NB3N502DR2G Clock Generator by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that guarantee reliability and performance. Clock generators play a crucial role in various applications such as data communication, telecommunications, and consumer electronics. The NB3N502DR2G offers advanced features and benefits, providing customers with precise clock signals and efficient power management. Upgrade your projects with this innovative clock generator from Onsemi and experience seamless operations and enhanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the clock generator.

Maximum Output Clock Frequency: 190 MHz

With a maximum output clock frequency of 190 MHz, this clock generator is suitable for applications requiring high-speed digital signal processing.

Minimum Operating Temperature: -40 °C

The clock generator can operate in temperatures as low as -40°C, making it suitable for a wide range of industrial environments.

Technology: CMOS

The CMOS technology used in this clock generator ensures low power consumption and compatibility with a variety of digital systems.

Nominal Primary Clock/Crystal Frequency: 25 MHz

The 25 MHz primary clock/crystal frequency provides stable and accurate clock signals for timing applications.

Technical Specifications

Clock Generators NB3N502DR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

190 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

NB3N502DR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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