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NB3N3011DTG

Onsemi

NB3N3011DTG by Onsemi

NB3N3011DTG Clock Generator by Onsemi operates at a max output frequency of 120 MHz with supply voltage range of 3.135-3.465 V. Ideal for industrial applications, it features a small outline package with 8 terminals and CMOS technology, suitable for surface mount assembly.

Median Price

$3.409

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40,194 parts In-Stock

1+ parts

-

100+ parts

$3.030

1k+ parts

$2.710

10k+ parts

$2.550

40,194

-

$3.030

$2.710

$2.550

Verical

USA . 17,778 parts In-Stock

1+ parts

-

100+ parts

$3.788

1k+ parts

$3.388

10k+ parts

$3.188

17,778

-

$3.788

$3.388

$3.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 926 parts In-Stock

1+ parts

$3.211

100+ parts

-

1k+ parts

-

10k+ parts

-

926

$3.211

-

-

-

Vyrian

USA . 7,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,020

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,479 parts In-Stock

1+ parts

$3.042

100+ parts

-

1k+ parts

-

10k+ parts

-

2,479

$3.042

-

-

-

Corohmni

South Africa . 179 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$3.050

-

-

-

AZTECH Wire

Italy . 768 parts In-Stock

1+ parts

$14.310

100+ parts

-

1k+ parts

-

10k+ parts

-

768

$14.310

-

-

-

Continental Prestige Electronics

USA . 40,238 parts In-Stock

1+ parts

-

100+ parts

$2.870

1k+ parts

-

10k+ parts

-

40,238

-

$2.870

-

-

Kulean Microsystems

USA . 8,167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,167

-

-

-

-

SupplyDigital Components

Austria . 6,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,762

-

-

-

-

Problanco Electronics

Mexico . 5,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,723

-

-

-

-

TANS Electronics

Latvia . 1,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,544

-

-

-

-

UHIMA Technologies

Türkiye . 336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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336

-

-

-

-

Microchip USA

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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172

-

-

-

-

Overview

Enhance your devices with the NB3N3011DTG clock generator from Onsemi, a leading manufacturer known for superior quality and reliability. Ideal for a wide range of applications, this clock generator offers precision timing solutions with a maximum output clock frequency of 120 MHz. With a small outline and thin profile package design, this product is perfect for space-constrained environments. Benefit from the ease of installation and high performance that this clock generator provides, delivering value and efficiency to your projects. Choose Onsemi for innovative solutions that elevate your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock generator, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and making the product more versatile for different applications.

Maximum Supply Voltage: 3.465 V

Ensures a stable power supply for the clock generator, allowing it to operate optimally within its specified voltage range.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easier integration into circuit designs and ensures a compact footprint for space-constrained applications.

Maximum Output Clock Frequency: 120 MHz

Offers a high output frequency range, suitable for various timing and synchronization tasks in electronic systems.

Power Supplies (V): 3.3

Operates on a standard power supply voltage, making it compatible with common power sources and easy to incorporate into existing designs.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, offering flexibility in circuit design and functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim profile of the package style saves space on the PCB and allows for a more streamlined layout in crowded electronic assemblies.

Minimum Supply Voltage: 3.135 V

Ensures reliable operation even when the supply voltage fluctuates slightly, providing stability and performance consistency in various operating conditions.

Maximum Operating Temperature: 85 °C

Capable of operating within a wide temperature range, suitable for industrial environments where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

Designed to withstand low temperatures, ensuring reliable performance in cold conditions without compromising functionality.

Terminal Finish: TIN

Tin finish on the terminals provides good solderability and corrosion resistance, extending the product's lifespan and reliability in different environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and enable various mounting options, improving design versatility and ease of installation.

Maximum Seated Height: 1.1 mm

Low seated height allows for a slim profile and compact design, ideal for space-constrained applications where vertical clearance is limited.

Width: 3 mm

Narrow width of the device facilitates efficient use of space on the PCB, enabling a more compact and integrated electronic system design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring proper soldering and reliable connections during the manufacturing process.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring the reliability and durability of the solder joints for long-term performance.

Length: 4.4 mm

The compact length of the device contributes to space-saving and allows for efficient placement on the PCB, enhancing overall design flexibility.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, providing reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile clock generator capable of generating various clock signals for different applications, offering flexibility and adaptability in electronic designs.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, making it efficient and reliable for clock generation tasks in electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical connections during soldering, ensuring robust and reliable electrical connections in various operating conditions.

Maximum Supply Current: 31 mA

Low supply current consumption helps in reducing power usage and heat dissipation, contributing to energy efficiency and prolonged product lifespan.

Nominal Supply Voltage: 3.3 V

Maintains a stable supply voltage for consistent performance, ensuring reliable operation and compatibility with standard power sources.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density mounting on the PCB, enabling compact designs and efficient use of space in electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate level of moisture sensitivity, ensuring proper handling and storage to prevent moisture-related damage during assembly and operation.

Nominal Primary Clock/Crystal Frequency: 25 MHz

Generates a primary clock or crystal frequency of 25 MHz, suitable for various timing and synchronization applications in electronic systems.

Technical Specifications

Clock Generators NB3N3011DTG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

120 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

31 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

NB3N3011DTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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