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NB3N501DR2G

Onsemi

NB3N501DR2G by Onsemi

NB3N501DR2G clock generator by Onsemi operates at a max output frequency of 160 MHz with supply voltages of 3.3/5 V. It is ideal for industrial applications, featuring a small outline package style and CMOS technology. This clock generator is surface mountable and has a temperature range from -40 to 85 °C.

Median Price

$2.513

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 11,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.600

10k+ parts

$2.600

11,139

-

-

$2.600

$2.600

Rochester

USA . 8,639 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

8,639

-

$2.240

$2.010

$1.890

Verical

USA . 6,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

-

6,139

-

-

$2.513

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 616 parts In-Stock

1+ parts

$2.375

100+ parts

-

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616

$2.375

-

-

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Vyrian

USA . 1,728 parts In-Stock

1+ parts

$2.500

100+ parts

-

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1,728

$2.500

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,549 parts In-Stock

1+ parts

$2.250

100+ parts

-

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1,549

$2.250

-

-

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Corohmni

South Africa . 363 parts In-Stock

1+ parts

$2.500

100+ parts

-

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363

$2.500

-

-

-

Component Stockers USA

USA . 11,539 parts In-Stock

1+ parts

$2.570

100+ parts

$2.410

1k+ parts

$2.180

10k+ parts

$2.180

11,539

$2.570

$2.410

$2.180

$2.180

Ampacity Inc.

Singapore . 9,392 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

-

10k+ parts

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9,392

$4.630

-

-

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Modulus Dynamics

Lithuania . 800 parts In-Stock

1+ parts

$24.350

100+ parts

$24.350

1k+ parts

$24.350

10k+ parts

-

800

$24.350

$24.350

$24.350

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Perfect Parts

USA . 14,280 parts In-Stock

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14,280

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TANS Electronics

Latvia . 5,410 parts In-Stock

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5,410

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Problanco Electronics

Mexico . 4,155 parts In-Stock

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4,155

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Kulean Microsystems

USA . 2,253 parts In-Stock

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2,253

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SupplyDigital Components

Austria . 1,086 parts In-Stock

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1,086

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UHIMA Technologies

Türkiye . 889 parts In-Stock

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889

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Microchip USA

USA . 361 parts In-Stock

1+ parts

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361

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Overview

Discover the NB3N501DR2G by Onsemi, a high-quality clock generator designed to meet your timing needs with precision and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this clock generator offers a wide range of applications in various industries. With its compact size and versatile features, this product provides exceptional value and benefits to customers looking for efficient clock generation solutions. Upgrade your systems with the NB3N501DR2G and experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this clock generator can handle a wide range of power inputs effectively.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space in electronic designs.

Maximum Output Clock Frequency: 160 MHz

This high output clock frequency enables fast processing and operation in electronic systems.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages provides flexibility in system design and compatibility.

No. of Terminals: 8

Having a sufficient number of terminals allows for easy connectivity and interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and is suitable for compact electronic devices.

Terminal Finish: TIN

Tin terminal finish offers good conductivity and solderability for reliable connections.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for use in diverse environmental conditions without performance degradation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in demanding thermal conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and durability in harsh industrial environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile clock generator functionality with additional features makes the product suitable for a range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Nominal Primary Clock/Crystal Frequency: 50 MHz

The specified clock/crystal frequency compatibility ensures accurate timekeeping and synchronization in the system.

Technical Specifications

Clock Generators NB3N501DR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

160 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

50 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

NB3N501DR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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