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NB3N51054DTG

Onsemi

NB3N51054DTG by Onsemi

NB3N51054DTG clock generator by Onsemi operates at 3.3V with a supply current of 130mA. It has a frequency of 25MHz, suitable for industrial applications. This CMOS technology device comes in a small outline package with dual terminals and can withstand temperatures from -40 to 85 °C.

Median Price

$4.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 31 parts In-Stock

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$4.680

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$4.680

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Chip1Stop

Japan . 62 parts In-Stock

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$16.300

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$16.300

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Flip Electronics (Authorized)

USA . 8,990 parts In-Stock

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8,990

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Rochester

USA . 8 parts In-Stock

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$2.380

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$2.130

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$2.000

8

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$2.380

$2.130

$2.000

Distributors (In-Stock)

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Digiode

USA . 1,456 parts In-Stock

1+ parts

$2.632

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1,456

$2.632

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Flip Electronics

USA . 8,990 parts In-Stock

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8,990

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Vyrian

USA . 7,276 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 961 parts In-Stock

1+ parts

$2.493

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961

$2.493

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Corohmni

South Africa . 325 parts In-Stock

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$2.770

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325

$2.770

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Microchip USA

USA . 435 parts In-Stock

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$14.112

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435

$14.112

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$47.313

100+ parts

$43.055

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$38.797

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600

$47.313

$43.055

$38.797

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Problanco Electronics

Mexico . 6,193 parts In-Stock

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Kulean Microsystems

USA . 5,234 parts In-Stock

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SupplyDigital Components

Austria . 3,064 parts In-Stock

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3,064

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UHIMA Technologies

Türkiye . 678 parts In-Stock

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Perfect Parts

USA . 556 parts In-Stock

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TANS Electronics

Latvia . 399 parts In-Stock

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399

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Authorized Procurement Solutions

USA . 62 parts In-Stock

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62

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GreenTree Electronics

Israel . 62 parts In-Stock

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62

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Overview

Elevate your electronic devices with the NB3N51054DTG by Onsemi, a top-quality clock generator that ensures precise timing and synchronization for optimal performance. As a leading manufacturer in the industry, Onsemi guarantees reliability and innovation in every product. Clock generators play a crucial role in various applications such as telecommunications, networking, and consumer electronics. With the NB3N51054DTG, customers can expect seamless operation, reduced power consumption, and improved efficiency, making it a valuable investment for any project. Experience the difference with Onsemi's cutting-edge technology and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and lightweight, ideal for portable devices.

Surface Mount: YES

Surface mount design saves space on the PCB and allows for automated assembly, increasing efficiency.

Maximum Supply Voltage: 3.465 V

Higher maximum supply voltage provides flexibility and compatibility with different power sources.

Minimum Supply Voltage: 3.135 V

Lower minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the clock generator to function in a wide range of environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the clock generator can operate in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable connections.

Maximum Supply Current: 130 mA

Moderate maximum supply current ensures efficient power consumption and reduces heat generation.

Nominal Primary Clock/Crystal Frequency: 25 MHz

Reliable clock frequency of 25 MHz ensures accurate timing and synchronization in various applications.

Technical Specifications

Clock Generators NB3N51054DTG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

130 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NB3N51054DTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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