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NB3N3001DTR2G

Onsemi

NB3N3001DTR2G by Onsemi

CLOCK GENERATOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$3.409

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44,970 parts In-Stock

1+ parts

-

100+ parts

$3.030

1k+ parts

$2.710

10k+ parts

$2.550

44,970

-

$3.030

$2.710

$2.550

Verical

USA . 44,970 parts In-Stock

1+ parts

-

100+ parts

$3.788

1k+ parts

$3.388

10k+ parts

$3.188

44,970

-

$3.788

$3.388

$3.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,426 parts In-Stock

1+ parts

$3.211

100+ parts

-

1k+ parts

-

10k+ parts

-

1,426

$3.211

-

-

-

Vyrian

USA . 3,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,263

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,072 parts In-Stock

1+ parts

$3.042

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

$3.042

-

-

-

Corohmni

South Africa . 171 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$3.050

-

-

-

AZTECH Wire

Italy . 104 parts In-Stock

1+ parts

$10.610

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$10.610

-

-

-

Advanced Electronics

New Zealand . 30 parts In-Stock

1+ parts

$28.999

100+ parts

$26.389

1k+ parts

$23.779

10k+ parts

-

30

$28.999

$26.389

$23.779

-

Continental Prestige Electronics

USA . 44,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.870

10k+ parts

-

44,970

-

-

$2.870

-

Problanco Electronics

Mexico . 6,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,993

-

-

-

-

TANS Electronics

Latvia . 3,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,101

-

-

-

-

SupplyDigital Components

Austria . 2,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,784

-

-

-

-

Kulean Microsystems

USA . 1,919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,919

-

-

-

-

UHIMA Technologies

Türkiye . 478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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478

-

-

-

-

Microchip USA

USA . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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269

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Technical Specifications

Clock Generators NB3N3001DTR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

212.5 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Peripheral IC Type:

Trade Compliance

NB3N3001DTR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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