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NB3N51044DTG

Onsemi

NB3N51044DTG by Onsemi

NB3N51044DTG clock generator by Onsemi operates at a max output frequency of 125 MHz with a supply voltage range of 3.135V to 3.465V. This CMOS technology device, in a small outline package, is ideal for industrial applications requiring precise clock generation and processor-specific peripheral ICs. With surface mount capability and dual terminal position, it offers reliable performance in temperature ranges from -40°C to 85°C.

Median Price

$4.190

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 47 parts In-Stock

1+ parts

$2.472

100+ parts

-

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47

$2.472

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Chip1Stop

Japan . 47 parts In-Stock

1+ parts

$3.030

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47

$3.030

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Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$5.610

100+ parts

$5.260

1k+ parts

$3.940

10k+ parts

$3.870

50

$5.610

$5.260

$3.940

$3.870

Adafruit Industries

USA . 5,000 parts In-Stock

1+ parts

$43.376

100+ parts

$39.472

1k+ parts

$35.568

10k+ parts

-

5,000

$43.376

$39.472

$35.568

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Rochester

USA . 3,600 parts In-Stock

1+ parts

-

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$3.790

1k+ parts

$3.390

10k+ parts

$3.190

3,600

-

$3.790

$3.390

$3.190

DigiKey

USA . 3,600 parts In-Stock

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$4.590

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3,600

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$4.590

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Flip Electronics (Authorized)

USA . 328 parts In-Stock

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328

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Verical

USA . 47 parts In-Stock

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47

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Digiode

USA . 1,584 parts In-Stock

1+ parts

$2.348

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1,584

$2.348

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Vyrian

USA . 1,497 parts In-Stock

1+ parts

$2.472

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1,497

$2.472

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Flip Electronics

USA . 328 parts In-Stock

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328

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Bristol Electronics

USA . 104 parts In-Stock

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104

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Distributors (Availability)

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Corphita

USA . 143 parts In-Stock

1+ parts

$2.225

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143

$2.225

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Corohmni

South Africa . 197 parts In-Stock

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$2.472

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197

$2.472

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$43.376

100+ parts

$39.472

1k+ parts

$35.568

10k+ parts

-

5,000

$43.376

$39.472

$35.568

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QUARKTWIN TECHNOLOGY LTD

USA . 25,155 parts In-Stock

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Problanco Electronics

Mexico . 6,347 parts In-Stock

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6,347

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SupplyDigital Components

Austria . 5,552 parts In-Stock

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Microchip USA

USA . 4,184 parts In-Stock

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TANS Electronics

Latvia . 2,554 parts In-Stock

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Kulean Microsystems

USA . 679 parts In-Stock

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679

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Perfect Parts

USA . 416 parts In-Stock

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416

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UHIMA Technologies

Türkiye . 120 parts In-Stock

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120

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Authorized Procurement Solutions

USA . 37 parts In-Stock

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37

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GreenTree Electronics

Israel . 37 parts In-Stock

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Overview

Elevate your clock generation capabilities with the NB3N51044DTG by Onsemi. Crafted with precision and expertise, this clock generator offers unparalleled quality and reliability. Ideal for a wide range of applications, this product from Onsemi provides customers with unmatched value and benefits. Experience seamless performance and efficiency with the NB3N51044DTG, a testament to Onsemi's commitment to excellence in clock generator technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the clock generator.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially in modern electronic devices with limited space.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for flexibility in power input options, making it compatible with a variety of systems.

Package Shape: RECTANGULAR

The rectangular package shape is a common and convenient form factor for easy integration into circuit boards.

Maximum Output Clock Frequency: 125 MHz

The high maximum output clock frequency enables fast and reliable operation in applications requiring precise timing.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard power sources and reduces the need for additional voltage regulation.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components or devices in a system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB and allows for denser board designs.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures efficient power usage and reliable performance even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock generator can withstand harsh environmental conditions and temperature fluctuations.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the clock generator to operate in extreme cold environments without compromising performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and conductivity for secure connections during installation.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in mounting options and allows for easy alignment during assembly.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in maintaining a low profile design and reduces the overall height of the device.

Width: 4.4 mm

The compact width of 4.4mm enables easy integration into space-constrained electronic systems or PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints and ensures long-term performance and durability.

Length: 9.7 mm

The compact length of 9.7mm contributes to a smaller footprint on the PCB and facilitates space-saving designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification guarantees reliable operation in industrial environments with varying temperature ranges.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Designed for processor-specific applications, this clock generator provides precise clock signals required for optimal processor performance.

Technology: CMOS

The CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and rework processes, ensuring secure and reliable connections.

Maximum Supply Current: 126 mA

The low maximum supply current consumption helps in reducing power usage and heat generation, leading to energy-efficient operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power delivery to the clock generator for reliable performance.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65mm, this clock generator offers precise connectivity and allows for high-density mounting on PCBs.

Nominal Primary Clock/Crystal Frequency: 25 MHz

The 25MHz primary clock/crystal frequency provides a standard reference for generating accurate clock signals in various applications.

Technical Specifications

Clock Generators NB3N51044DTG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

125 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

126 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NB3N51044DTG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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