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NB3N5573DTR2G

Onsemi

NB3N5573DTR2G by Onsemi

NB3N5573DTR2G clock generator by Onsemi operates at a max output frequency of 200 MHz with a supply voltage range of 2.97V to 3.63V. This CMOS technology device has 16 terminals in a small outline package, suitable for industrial applications requiring precise timing and clock generation up to 25 MHz.

Median Price

$2.566

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 2,165 parts In-Stock

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$2.260

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Arrow

USA . 1,608 parts In-Stock

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$2.265

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Mouser Electronics

USA . 2,203 parts In-Stock

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$4.400

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$2.920

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$2.690

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$2.690

2,203

$4.400

$2.920

$2.690

$2.690

DigiKey

USA . 1,528 parts In-Stock

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$4.750

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$3.019

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$2.706

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$2.627

1,528

$4.750

$3.019

$2.706

$2.627

Rochester

USA . 288,283 parts In-Stock

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$2.420

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$2.170

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$2.040

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Verical

USA . 251,116 parts In-Stock

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$2.550

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Distributors (In-Stock)

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Digiode

USA . 1,944 parts In-Stock

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$2.556

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Nova Conductors

Japan . 32 parts In-Stock

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$2.840

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Vyrian

USA . 50,678 parts In-Stock

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Flip Electronics

USA . 8,244 parts In-Stock

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Component Sense

UK . 2,120 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,808 parts In-Stock

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Bristol Electronics

USA . 1,808 parts In-Stock

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$1.999

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$1.756

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Dan-Mar Components

USA . 1,808 parts In-Stock

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Cogito LLC

Ukraine . 40 parts In-Stock

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Ampacity Inc.

Singapore . 51,051 parts In-Stock

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$2.050

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$2.050

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Corohmni

South Africa . 66 parts In-Stock

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$2.060

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$2.060

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Corphita

USA . 1,799 parts In-Stock

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$2.421

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Continental Prestige Electronics

USA . 4,682 parts In-Stock

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$2.761

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$2.706

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$2.761

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Argo Parts USA

USA . 3,500 parts In-Stock

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$2.761

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$2.761

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Semicontronic

India . 50,564 parts In-Stock

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$4.460

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$4.348

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$4.326

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$4.460

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Aztec Data Supply Inc.

USA . 221 parts In-Stock

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$16.900

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Microchip USA

USA . 4,310 parts In-Stock

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$17.740

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$17.630

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$17.580

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$17.520

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Perfect Parts

USA . 71,510 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 7,227 parts In-Stock

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SupplyDigital Components

Austria . 6,847 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,258 parts In-Stock

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Problanco Electronics

Mexico . 4,598 parts In-Stock

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Kulean Microsystems

USA . 3,594 parts In-Stock

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GreenTree Electronics

Israel . 2,994 parts In-Stock

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Authorized Procurement Solutions

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Assy Fe

Spain . 1,000 parts In-Stock

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Lixinc

USA . 731 parts In-Stock

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Futuretech Components

Singapore . 708 parts In-Stock

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UHIMA Technologies

Türkiye . 392 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 107 parts In-Stock

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Overview

Elevate your clock generation capabilities with the NB3N5573DTR2G by Onsemi. Crafted with precision and expertise, this clock generator from a renowned manufacturer offers unparalleled quality and reliability. Ideal for a wide range of applications, this clock generator guarantees seamless performance and accuracy. Experience the value and benefits of this product firsthand - unlock greater efficiency and productivity in your projects. Choose Onsemi and elevate your clock generation experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable devices.

Maximum Output Clock Frequency: 200 MHz

The high maximum output clock frequency of 200 MHz allows for fast processing speed and efficient performance of the product.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V ensures compatibility with standard voltage requirements and allows for stable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments without overheating.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Clock Generators NB3N5573DTR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

25 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

NB3N5573DTR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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