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FS6377-01G-XTP

Onsemi

FS6377-01G-XTP by Onsemi

FS6377-01G-XTP Clock Generator by Onsemi operates at a max output clock frequency of 150 MHz with supply voltages of 3.3/5 V. This CMOS technology device, suitable for processors, comes in a small outline package with 16 terminals and matte tin finish. It is designed for commercial applications requiring precise timing functions in a compact form factor.

Median Price

$3.200

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 984 parts In-Stock

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$3.200

100+ parts

$3.010

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$2.720

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984

$3.200

$3.010

$2.720

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Digiode

USA . 2,277 parts In-Stock

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$3.040

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$3.040

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Nova Conductors

Japan . 450 parts In-Stock

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$3.260

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Vyrian

USA . 7,617 parts In-Stock

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Flip Electronics

USA . 7,375 parts In-Stock

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Chip Stock

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Component Sense

UK . 2,354 parts In-Stock

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Semi Source

USA . 164 parts In-Stock

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Ampacity Inc.

Singapore . 582 parts In-Stock

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$2.720

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582

$2.720

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Corphita

USA . 802 parts In-Stock

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$2.880

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802

$2.880

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Corohmni

South Africa . 70 parts In-Stock

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$3.200

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70

$3.200

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Netroflash

USA . 100 parts In-Stock

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$3.260

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100

$3.260

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AZTECH Wire

Italy . 346 parts In-Stock

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$17.167

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TANS Electronics

Latvia . 7,018 parts In-Stock

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SupplyDigital Components

Austria . 6,113 parts In-Stock

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Kepictronics

USA . 5,150 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,028 parts In-Stock

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Microchip USA

USA . 4,726 parts In-Stock

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Assy Fe

Spain . 4,132 parts In-Stock

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Kulean Microsystems

USA . 3,187 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,774 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,849 parts In-Stock

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Problanco Electronics

Mexico . 1,440 parts In-Stock

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UHIMA Technologies

Türkiye . 815 parts In-Stock

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Metaverse IC Inc.

Canada . 784 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock the power of precise timing with the FS6377-01G-XTP Clock Generator by Onsemi. Manufactured with top-notch quality and expertise, this clock generator is perfect for a wide range of applications. From ensuring synchronization in data communication to enhancing performance in processor-specific devices, this product offers unmatched value and reliability. Say goodbye to delays and hello to seamless operations with the FS6377-01G-XTP - the ultimate solution for all your timing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the clock generator lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this clock generator can operate efficiently in a wide range of voltage environments.

Maximum Output Clock Frequency: 150 MHz

The high maximum output clock frequency of 150 MHz ensures precise timing and synchronization in advanced electronic systems.

Minimum Operating Temperature: 0 °C

The clock generator can function reliably in low-temperature environments, making it suitable for various operating conditions.

Maximum Operating Temperature: 70 °C

The clock generator has a high maximum operating temperature, ensuring stability and performance even in elevated temperature settings.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The clock generator's nominal primary clock/crystal frequency of 27 MHz provides a stable reference signal for precise timekeeping and synchronization.

Technical Specifications

Clock Generators FS6377-01G-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

150 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FS6377-01G-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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