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FS6370-01-XTP

Onsemi

FS6370-01-XTP by Onsemi

FS6370-01-XTP by Onsemi is a clock generator with 16 terminals, operating at 3.3/5V. It has a max temp of 70 °C and min temp of 0°C, suitable for commercial applications. The package is small outline plastic/epoxy with surface mount capability, making it versatile for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Sea View Technologies

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Bristol Electronics

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Northwest PG Solutions

USA . 1,122 parts In-Stock

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SupplyDigital Components

Austria . 6,767 parts In-Stock

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TANS Electronics

Latvia . 6,247 parts In-Stock

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Kulean Microsystems

USA . 5,390 parts In-Stock

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Problanco Electronics

Mexico . 4,456 parts In-Stock

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Corphita

USA . 2,428 parts In-Stock

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Native Components

USA . 954 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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Overview

Elevate your clock generator game with the FS6370-01-XTP by Onsemi. Crafted with precision and expertise, this innovative product boasts a range of applications in various industries. From telecommunications to consumer electronics, this clock generator offers unparalleled value and benefits to customers. With high-quality manufacturing and cutting-edge technology, Onsemi delivers a reliable and efficient solution that ensures optimal performance. Upgrade your systems with the FS6370-01-XTP and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, saving time and space in the production process.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) adds flexibility and compatibility with different systems.

No. of Terminals: 16

Having 16 terminals allows for connection to a variety of components and peripherals, enhancing the product's versatility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function effectively in a wide range of temperature conditions.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product meets standard temperature requirements for most commercial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Maximum Supply Current: 43 mA

With a maximum supply current of 43 mA, the product consumes low power, making it energy-efficient.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for high-density mounting of components, enabling compact and space-saving PCB layouts.

Technical Specifications

Clock Generators FS6370-01-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

43 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

FS6370-01-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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