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FS6322-04

Onsemi

FS6322-04 by Onsemi

FS6322-04 by Onsemi is a clock generator with max output frequency of 48.00026 MHz, suitable for commercial applications. It operates b/w 0-70 °C and has 16 terminals in a small outline package style. With CMOS technology and supply voltage range of 3-3.6 V, it's ideal for surface mount designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 853 parts In-Stock

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Digiode

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Northwest PG Solutions

USA . 1,781 parts In-Stock

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$3.130

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TANS Electronics

Latvia . 5,016 parts In-Stock

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Kulean Microsystems

USA . 4,796 parts In-Stock

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SupplyDigital Components

Austria . 4,493 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Problanco Electronics

Mexico . 2,291 parts In-Stock

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Corphita

USA . 912 parts In-Stock

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UHIMA Technologies

Türkiye . 733 parts In-Stock

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Corohmni

South Africa . 490 parts In-Stock

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Native Components

USA . 368 parts In-Stock

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Overview

Upgrade your devices with the FS6322-04 Clock Generator by Onsemi, a leader in quality electronic components. Designed for maximum performance and reliability, this clock generator offers a wide range of applications, guaranteeing precision and efficiency. With Onsemi's trusted reputation and commitment to innovation, you can trust that this product will deliver exceptional results. Experience seamless integration and enhanced functionality with the FS6322-04, providing unparalleled value and benefits to customers looking for top-notch performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the clock generator easy to handle and install.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the PCB and compact design.

Maximum Output Clock Frequency: 48.00026 MHz

High maximum output clock frequency enables the clock generator to support various high-speed applications.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact designs.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage allows for operation in a wide range of voltage conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Wide range of operating temperature enables the clock generator to be used in different climates and environments.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and system integration.

Maximum Seated Height: 1.75 mm

Low seated height allows for slim and compact designs in space-constrained applications.

Width: 3.9 mm

Narrow width saves space on the PCB and enables compact system designs.

Length: 9.9 mm

Compact length allows for efficient space utilization on the PCB.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in typical commercial operating conditions.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Specifically designed clock generator peripheral IC type ensures accurate and reliable clock generation for the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering to the PCB and secure connections.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage ensures stable operation and compatibility with other components in the system.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration and compatibility with various PCB layouts.

Nominal Primary Clock/Crystal Frequency: 30 MHz

Nominal primary clock/crystal frequency supports stable clock generation for the system.

Technical Specifications

Clock Generators FS6322-04 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

48.00026 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

30 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

FS6322-04 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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