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FS6370-01-XTD

Onsemi

FS6370-01-XTD by Onsemi

FS6370-01-XTD by Onsemi is a Clock Generator with 16 terminals, operating at 3.3/5V. It features CMOS technology, GULL WING terminals, and operates b/w 0-70 °C. Ideal for applications requiring precise clock generation in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,133 parts In-Stock

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Vyrian

USA . 68 parts In-Stock

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Northwest PG Solutions

USA . 2,059 parts In-Stock

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$2.937

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Kulean Microsystems

USA . 7,990 parts In-Stock

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Problanco Electronics

Mexico . 6,358 parts In-Stock

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SupplyDigital Components

Austria . 4,313 parts In-Stock

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Corphita

USA . 1,650 parts In-Stock

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TANS Electronics

Latvia . 986 parts In-Stock

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Corohmni

South Africa . 342 parts In-Stock

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UHIMA Technologies

Türkiye . 259 parts In-Stock

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Native Components

USA . 12 parts In-Stock

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Overview

Unlock precision and reliability with the FS6370-01-XTD Clock Generator by Onsemi. Crafted with top-tier materials and cutting-edge technology, this product is designed to exceed expectations in a variety of applications. Whether you're in need of precise timing for data communication or synchronization in networking equipment, this clock generator delivers unmatched performance. Trust in Onsemi's reputation for quality and innovation, and experience the seamless integration and enhanced functionality that this product offers. Elevate your projects with the FS6370-01-XTD Clock Generator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes it easy to integrate into compact circuit designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a PCB.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) offers flexibility in different system configurations.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and enables dense circuit layouts.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance under demanding conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for usage in a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and better connectivity options.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures compatibility with standard operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for clock generation applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto the PCB for simplified assembly.

Maximum Supply Current: 43 mA

With a maximum supply current of 43mA, the product operates efficiently without drawing excessive power.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm allows for high-density mounting and space-saving on the PCB.

Technical Specifications

Clock Generators FS6370-01-XTD attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

43 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

FS6370-01-XTD Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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