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FS6322-01

Onsemi

FS6322-01 by Onsemi

FS6322-01 by Onsemi is a Clock Generator with 16 terminals, operating at 3.3V nominal voltage and up to 48.00026 MHz output clock frequency. It is designed for processors, featuring CMOS technology in a small outline package suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,031 parts In-Stock

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Digiode

USA . 1,449 parts In-Stock

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Kulean Microsystems

USA . 8,020 parts In-Stock

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TANS Electronics

Latvia . 5,801 parts In-Stock

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Northwest PG Solutions

USA . 2,286 parts In-Stock

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Problanco Electronics

Mexico . 2,203 parts In-Stock

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Corphita

USA . 2,092 parts In-Stock

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SupplyDigital Components

Austria . 1,051 parts In-Stock

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UHIMA Technologies

Türkiye . 503 parts In-Stock

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Native Components

USA . 359 parts In-Stock

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Corohmni

South Africa . 312 parts In-Stock

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Overview

Enhance your devices with the FS6322-01 Clock Generator by Onsemi! With a focus on precision and reliability, Onsemi is a trusted manufacturer known for delivering top-notch products. Clock generators play a crucial role in various applications, ensuring optimal performance and synchronization. The FS6322-01 offers customers exceptional value, benefits, and advantages, making it the perfect choice for those seeking quality and efficiency in their electronic systems. Upgrade your devices today with the FS6322-01 Clock Generator from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the clock generator, ensuring its longevity and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly more convenient.

Maximum Supply Voltage: 3.6 V

The ability to handle up to 3.6V ensures compatibility with a wide range of power supply systems, increasing flexibility in design.

Maximum Output Clock Frequency: 48.00026 MHz

The high output clock frequency allows for precise synchronization in demanding applications, such as data communication and signal processing.

No. of Terminals: 16

With 16 terminals, this clock generator offers plenty of connectivity options for interfacing with other components in the system.

Maximum Operating Temperature: 70 °C

The wide operating temperature range up to 70 °C ensures reliable performance in various environmental conditions without overheating.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Being a processor-specific clock generator ensures compatibility and seamless integration with the target processor, optimizing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator efficient and reliable in digital circuits.

Technical Specifications

Clock Generators FS6322-01 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPERATES AT 5 V

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

48.00026 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

30 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

FS6322-01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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