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FS6370-01G-XTD

Onsemi

FS6370-01G-XTD by Onsemi

FS6370-01G-XTD by Onsemi is a Clock Generator with 150 MHz output frequency, 16 terminals, and 5.5 V max supply voltage. Ideal for processors, it operates b/w 0 to 70 °C and supports both 3.3V/5V power supplies in commercial-grade applications.

Median Price

$9.781

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 28 parts In-Stock

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$13.800

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$13.800

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Avnet

USA . 31 parts In-Stock

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$5.762

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$5.466

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31

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$5.762

$5.466

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Distributors (In-Stock)

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Nova Conductors

Japan . 85 parts In-Stock

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$5.765

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85

$5.765

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Digiode

USA . 2,488 parts In-Stock

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$13.110

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Vyrian

USA . 6,535 parts In-Stock

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Chip Stock

USA . 164 parts In-Stock

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Corphita

USA . 74 parts In-Stock

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$12.420

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$12.420

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Corohmni

South Africa . 88 parts In-Stock

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$13.800

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88

$13.800

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AZTECH Wire

Italy . 813 parts In-Stock

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$15.428

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813

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Kulean Microsystems

USA . 7,430 parts In-Stock

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TANS Electronics

Latvia . 6,611 parts In-Stock

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Problanco Electronics

Mexico . 5,625 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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SupplyDigital Components

Austria . 3,661 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.649

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$5.476

10k+ parts

$5.361

2,000

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$5.649

$5.476

$5.361

UHIMA Technologies

Türkiye . 935 parts In-Stock

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935

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Perfect Parts

USA . 679 parts In-Stock

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Microchip USA

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Kepictronics

USA . 200 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 28 parts In-Stock

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Overview

Enhance your electronic devices with the FS6370-01G-XTD Clock Generator by Onsemi, the industry leader in innovative semiconductor solutions. Perfect for a wide range of applications, this clock generator offers unmatched quality and reliability. With a maximum output clock frequency of 150 MHz and a small outline package style, this product provides optimal performance while maximizing space efficiency. Trust Onsemi to deliver top-notch products that meet your needs and exceed your expectations. Upgrade your technology today with the FS6370-01G-XTD Clock Generator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, ensuring the clock generator is robust and easy to handle during installation.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage tolerance provides flexibility in power supply options, increasing compatibility with various system designs.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and allows for easy integration into circuit layouts, ensuring a simple and efficient design process.

Maximum Output Clock Frequency: 150 MHz

High maximum output clock frequency of 150 MHz ensures reliable performance in demanding applications that require fast and precise timing signals.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages (3.3V and 5V) provides compatibility with different system requirements, allowing for versatile use.

No. of Terminals: 16

Having 16 terminals allows for a wide range of connection options, enabling the clock generator to interface with various components in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 4.5 V

Relatively low minimum supply voltage requirement ensures efficient power usage and compatibility with lower voltage systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows the clock generator to operate reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the clock generator can function effectively even in cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections, extending the lifespan of the clock generator.

Terminal Position: DUAL

Dual terminal positioning enhances stability and facilitates secure mounting on the circuit board, preventing any potential connection issues.

Width: 3.9 mm

Narrow width dimension allows for compact integration and placement on the board, enabling efficient use of space within the system design.

Maximum Supply Current: 43 mA

Moderate maximum supply current draw ensures efficient power consumption and reduces the strain on the power supply, promoting energy savings.

Technical Specifications

Clock Generators FS6370-01G-XTD attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

150 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

43 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FS6370-01G-XTD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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