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FS6377-01IG-XTP

Onsemi

FS6377-01IG-XTP by Onsemi

FS6377-01IG-XTP by Onsemi is a Clock Generator with 150 MHz output frequency, suitable for industrial applications. It operates at 4.5-5.5 V, in temperatures ranging from -40 to 85 °C. This CMOS technology device comes in a small outline package with matte tin finish and dual terminal position.

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Vyrian

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AZTECH Wire

Italy . 1,139 parts In-Stock

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Component Stockers USA

USA . 396 parts In-Stock

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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TANS Electronics

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UHIMA Technologies

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Microchip USA

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Overview

Discover the FS6377-01IG-XTP by Onsemi, a top-of-the-line clock generator that guarantees precision and reliability in all your applications. With Onsemi's renowned reputation for quality and innovation, this product offers unparalleled performance and efficiency. Whether you're in need of clock signals for processors or any other specific application, this clock generator is the ideal solution. Experience seamless operation and peace of mind knowing that you're getting the best value for your money with the FS6377-01IG-XTP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the clock generator, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability makes it easy to integrate this clock generator into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a range of systems.

Package Shape: RECTANGULAR

The rectangular shape of the package enables easy placement and secure mounting within electronic devices.

Maximum Output Clock Frequency: 150 MHz

The high maximum output clock frequency ensures reliable and precise timing for various applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows for versatile use in different types of electronic systems.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and facilitates compact designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock generator can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a stable and corrosion-resistant surface for reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit board layout and ease of connections during assembly.

Maximum Seated Height: 1.73 mm

The low maximum seated height allows for a slim profile and space-saving installation in electronic devices.

Width: 3.9 mm

The compact width of the clock generator enables easy integration into tight spaces on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, the clock generator can be quickly and effectively soldered onto the circuit board during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Length: 9.89 mm

The moderate length of the clock generator allows for easy placement and secure mounting within electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions typical in industrial settings.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Being processor-specific, this clock generator is optimized for compatibility and performance with specific processors, enhancing overall system efficiency.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption and high noise immunity for reliable clock signal generation.

Terminal Form: GULL WING

The gull wing terminal form provides secure and efficient soldering connections for reliable electrical performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power supply configurations in electronics.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for compact layout on the circuit board and efficient signal routing.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, this clock generator can withstand moderate exposure to moisture during storage and assembly processes.

Nominal Primary Clock/Crystal Frequency: 27 MHz

The nominal primary clock/crystal frequency of 27 MHz provides a stable and accurate reference signal for timing applications.

Technical Specifications

Clock Generators FS6377-01IG-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

150 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FS6377-01IG-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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