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FS6370-01G-XTP

Onsemi

FS6370-01G-XTP by Onsemi

FS6370-01G-XTP by Onsemi is a Clock Generator with 150 MHz output frequency, suitable for processors. Operating at 4.5-5.5 V, it has 16 terminals in a small outline package style. With CMOS technology and Gull Wing terminal form, it offers high performance in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,416 parts In-Stock

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 523 parts In-Stock

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TANS Electronics

Latvia . 6,234 parts In-Stock

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Problanco Electronics

Mexico . 6,215 parts In-Stock

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Kulean Microsystems

USA . 5,559 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Corphita

USA . 1,448 parts In-Stock

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SupplyDigital Components

Austria . 1,236 parts In-Stock

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UHIMA Technologies

Türkiye . 783 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 200 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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GreenTree Electronics

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Overview

Enhance your electronic projects with the high-quality FS6370-01G-XTP Clock Generator by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers reliable products that cater to a wide range of applications. This clock generator not only offers exceptional performance but also provides customers with value and benefits that set it apart from others in its category. Upgrade your designs with precision and efficiency using the FS6370-01G-XTP and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the clock generator.

Maximum Output Clock Frequency: 150 MHz

High clock frequency allows for precise and accurate timing signals, making it suitable for applications that require high-speed processing.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages allows flexibility in different system requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the system, enabling seamless integration.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the clock generator energy-efficient and reliable.

Technical Specifications

Clock Generators FS6370-01G-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

150 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

27 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

43 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FS6370-01G-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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