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7WB3306DMR2G

Onsemi

7WB3306DMR2G by Onsemi

The Onsemi 7WB3306DMR2G is a Bus Driver & Transceiver with 2 bits, operating at a supply voltage range of 4-5.5V. It features a propagation delay of 0.25ns and can withstand temperatures from -55 to 125 °C. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,910 parts In-Stock

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4,910

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Digiode

USA . 1,128 parts In-Stock

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1,128

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Distributors (Availability)

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AZTECH Wire

Italy . 337 parts In-Stock

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$18.600

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337

$18.600

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QUARKTWIN TECHNOLOGY LTD

USA . 27,753 parts In-Stock

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Kulean Microsystems

USA . 7,289 parts In-Stock

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Problanco Electronics

Mexico . 3,738 parts In-Stock

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3,738

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TANS Electronics

Latvia . 2,496 parts In-Stock

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2,496

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Northwest PG Solutions

USA . 1,314 parts In-Stock

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$4.277

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1,314

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$4.277

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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865

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Microchip USA

USA . 426 parts In-Stock

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Native Components

USA . 333 parts In-Stock

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$4.234

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333

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$4.234

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SupplyDigital Components

Austria . 333 parts In-Stock

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333

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Corphita

USA . 159 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Enhance your electronic designs with the high-quality 7WB3306DMR2G bus driver & transceiver from Onsemi. Known for their reliable products, Onsemi delivers superior performance and durability in every component. This surface mount device offers unmatched value with its small outline package and fast propagation delay. Ideal for military-grade applications, this dual-terminal transceiver ensures precise and efficient data transmission. Upgrade your projects with Onsemi's innovative technology and experience seamless connectivity like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, making this product easy to integrate into electronic systems.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications with limited board space.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of power supplies and operating conditions.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25ns enables fast signal transmission, making this product suitable for high-speed data communication.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand elevated temperatures in harsh operating environments.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55 °C ensures reliable performance in cold environments, making this product versatile in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and durability.

No. of Ports: 2

Having two ports allows for simultaneous data transmission or reception, making this product suitable for applications requiring multiple data channels.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product can operate in extreme temperature conditions, making it suitable for defense and aerospace applications.

Technical Specifications

Bus Driver & Transceivers 7WB3306DMR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

3306

JESD-30 Code:

S-XDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

7WB3306DMR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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