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7WB3125BMX1TCG

Onsemi

7WB3125BMX1TCG by Onsemi

The Onsemi 7WB3125BMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 0.25 ns and supports a supply voltage range of 4-5.5 V. Ideal for military-grade applications requiring small outline packages and true output polarity.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,280 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

3,280

-

$0.225

$0.186

$0.166

DigiKey

USA . 3,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

3,280

-

-

-

$0.190

Verical

USA . 3,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

3,280

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 951 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

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951

$0.175

-

-

-

Vyrian

USA . 374 parts In-Stock

1+ parts

$0.184

100+ parts

-

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374

$0.184

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 300 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

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300

$0.166

-

-

-

Corohmni

South Africa . 325 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

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325

$0.184

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,423 parts In-Stock

1+ parts

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25,423

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SupplyDigital Components

Austria . 6,458 parts In-Stock

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6,458

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Microchip USA

USA . 5,511 parts In-Stock

1+ parts

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5,511

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Kulean Microsystems

USA . 4,516 parts In-Stock

1+ parts

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4,516

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TANS Electronics

Latvia . 4,228 parts In-Stock

1+ parts

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4,228

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Problanco Electronics

Mexico . 4,031 parts In-Stock

1+ parts

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100+ parts

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4,031

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Continental Prestige Electronics

USA . 3,280 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.165

10k+ parts

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3,280

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-

$0.165

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Northwest PG Solutions

USA . 1,591 parts In-Stock

1+ parts

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1,591

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Native Components

USA . 987 parts In-Stock

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987

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UHIMA Technologies

Türkiye . 195 parts In-Stock

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195

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Overview

Unlock the power of seamless communication with the 7WB3125BMX1TCG by Onsemi. Crafted with precision and expertise, this Bus Driver & Transceiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures smooth data transmission with its innovative design. Experience the value and benefits of this superior product, providing customers with a competitive edge in their projects. Trust Onsemi to deliver cutting-edge solutions that elevate your performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 4.5

Operates efficiently at a nominal supply voltage of 4.5V, making it energy efficient.

Propagation Delay (tpd): 0.25 ns

Fast propagation delay ensures quick response in data transmission, improving overall performance.

Maximum Operating Temperature: 125 °C

Operates reliably at high temperatures, suitable for various operating conditions.

Width: 1 mm

Compact width size allows for easy integration into tight spaces and compact designs.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission without distortion.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability in harsh environmental conditions.

Technical Specifications

Bus Driver & Transceivers 7WB3125BMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7WB3125BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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