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7WB3306AMX1TCG

Onsemi

7WB3306AMX1TCG by Onsemi

The Onsemi 7WB3306AMX1TCG is a Bus Driver & Transceiver with 2 bits, 0.25 ns propagation delay, and operating temperature range of -55 to 125 °C. It is used in military applications requiring a very thin profile, fine pitch package style for high-speed data transmission.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

9,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

9,000

-

-

-

$0.200

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

9,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,097 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

2,097

$0.158

-

-

-

Digiode

USA . 883 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$0.185

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 413 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$0.158

-

-

-

Corphita

USA . 1,832 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

1,832

$0.176

-

-

-

Native Components

USA . 121 parts In-Stock

1+ parts

$9.064

100+ parts

-

1k+ parts

-

10k+ parts

-

121

$9.064

-

-

-

Northwest PG Solutions

USA . 806 parts In-Stock

1+ parts

$9.970

100+ parts

$8.973

1k+ parts

-

10k+ parts

-

806

$9.970

$8.973

-

-

Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.175

10k+ parts

-

9,000

-

-

$0.175

-

TANS Electronics

Latvia . 7,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,999

-

-

-

-

Problanco Electronics

Mexico . 7,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,495

-

-

-

-

Kulean Microsystems

USA . 2,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,238

-

-

-

-

SupplyDigital Components

Austria . 1,409 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,409

-

-

-

-

UHIMA Technologies

Türkiye . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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260

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-

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Microchip USA

USA . 189 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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189

-

-

-

-

Overview

Experience seamless and reliable data transmission with the 7WB3306AMX1TCG bus driver & transceiver from Onsemi. This high-quality product offers unparalleled performance in a compact package, making it perfect for a wide range of applications. With a temperature grade of MILITARY and a nominal supply voltage of 4.5V, this device ensures optimal functionality even in extreme conditions. Trust Onsemi's reputation for excellence and choose the 7WB3306AMX1TCG for your next project to enjoy unmatched value and benefits.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for automated assembly, saving time and cost in production.

Package Shape: RECTANGULAR

Rectangular shape is commonly used in electronic components, making it compatible with existing designs and layouts.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V provides a balance between power consumption and performance.

Propagation Delay (tpd): 0.25 ns

Low propagation delay ensures quick data transmission, suitable for high-speed communication applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the component to withstand harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

No. of Ports: 2

Having 2 ports enables the component to send and receive data from multiple sources simultaneously.

Width: 1 mm

Compact width of 1mm saves space on the PCB and allows for dense circuit layouts.

Temperature Grade: MILITARY

Military-grade temperature range ensures the component can operate in extreme conditions for reliable performance in all environments.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the component can handle higher voltage inputs without damage, increasing versatility.

Technical Specifications

Bus Driver & Transceivers 7WB3306AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

3306

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1 mm

Trade Compliance

7WB3306AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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