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7WB3125DMUTCG

Onsemi

7WB3125DMUTCG by Onsemi

7WB3125DMUTCG by Onsemi is a Bus Driver & Transceiver with 2 functions, 8 terminals, and 3-STATE output. It operates b/w -55 to 125 °C, has 0.25 ns propagation delay, and supports supply voltage range of 4-5. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,084 parts In-Stock

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Digiode

USA . 570 parts In-Stock

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570

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Native Components

USA . 703 parts In-Stock

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$5.370

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703

$5.370

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Kulean Microsystems

USA . 7,831 parts In-Stock

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Problanco Electronics

Mexico . 7,574 parts In-Stock

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TANS Electronics

Latvia . 3,942 parts In-Stock

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SupplyDigital Components

Austria . 2,644 parts In-Stock

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Northwest PG Solutions

USA . 1,211 parts In-Stock

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$5.263

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UHIMA Technologies

Türkiye . 458 parts In-Stock

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Corohmni

South Africa . 138 parts In-Stock

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Corphita

USA . 94 parts In-Stock

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Overview

Enhance your electronic designs with the 7WB3125DMUTCG by Onsemi, a top-tier manufacturer known for high-quality bus drivers and transceivers. This versatile product offers a variety of applications in the field of electronics, providing customers with value and benefits that go beyond just functionality. With its advanced technology and military-grade temperature grade, this small outline, very thin profile package delivers true output polarity and impressive propagation delay, making it a must-have for your next project. Experience the advantages of Onsemi's expertise and innovation with the 7WB3125DMUTCG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the bus driver and transceivers.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards, saving time and effort during assembly.

No. of Functions: 2

Provides flexibility and versatility in the functionality of the product, allowing for multiple tasks to be performed efficiently.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for the proper functioning of the bus driver and transceivers, ensuring stability and reliability.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without affecting performance, suitable for various environmental conditions.

Output Characteristics: 3-STATE

Allows for tristate outputs, providing flexibility in the control and management of signals in the system.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and fast switching speeds, optimizing performance.

Technical Specifications

Bus Driver & Transceivers 7WB3125DMUTCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

Length:

1.95 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7WB3125DMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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