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7WB3125AMX1TCG

Onsemi

7WB3125AMX1TCG by Onsemi

7WB3125AMX1TCG by Onsemi is a Bus Driver & Transceiver with 2 functions, 8 terminals, and 0.25 ns propagation delay. It operates b/w -55 to 125 °C and has a supply voltage range of 4-5.5 V. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

6,000

-

$0.225

$0.186

$0.166

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

6,000

-

-

-

$0.190

Farnell

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.151

6,000

-

-

-

$0.151

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.233

6,000

-

-

-

$0.233

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,071 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$0.151

-

-

-

Digiode

USA . 1,788 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

1,788

$0.175

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 296 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

-

296

$0.151

-

-

-

Corphita

USA . 2,413 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

2,413

$0.166

-

-

-

Northwest PG Solutions

USA . 1,684 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

-

10k+ parts

-

1,684

$3.087

-

-

-

Problanco Electronics

Mexico . 7,004 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,004

-

-

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Kulean Microsystems

USA . 6,884 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,884

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.165

10k+ parts

-

6,000

-

-

$0.165

-

TANS Electronics

Latvia . 2,943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,943

-

-

-

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SupplyDigital Components

Austria . 2,808 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,808

-

-

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UHIMA Technologies

Türkiye . 935 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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935

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Microchip USA

USA . 388 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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388

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Native Components

USA . 304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.722

10k+ parts

-

304

-

-

$2.722

-

Overview

Experience the power of innovation with the 7WB3125AMX1TCG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers & transceivers that are versatile and reliable. This product offers seamless performance and efficiency, making it ideal for a wide range of applications. With a focus on value and customer satisfaction, the 7WB3125AMX1TCG provides numerous benefits and advantages to meet your needs. Trust Onsemi to elevate your projects to the next level with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to external impacts, making it a reliable choice for a bus driver or transceiver.

Surface Mount: YES

Surface mount capability allows for easy installation on a PCB, saving space and simplifying the assembly process.

No. of Functions: 2

With 2 functions integrated into one component, this product offers versatility and efficiency in managing bus communication and data transmission.

Package Shape: RECTANGULAR

The rectangular package shape helps in optimizing space on the PCB and facilitates easy placement and alignment during assembly.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V supply voltage ensures stable and reliable operation of the bus driver or transceiver, making it suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and interfaces, enabling seamless integration into the overall bus communication system.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces overall footprint on the PCB, making it ideal for compact designs and space-constrained applications.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25ns ensures fast data transmission and minimal signal latency, enhancing the efficiency of the bus communication system.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliability and stability even in harsh environmental conditions or extended operation periods.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in managing bus signals and controlling the driver or transceiver output, enhancing versatility in system design.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable performance even in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of Nickel/Palladium/Gold terminal finish ensures good conductivity, corrosion resistance, and reliability in signal transmission, enhancing the overall performance of the component.

Terminal Position: DUAL

The dual terminal position allows for easy connection and secure mounting on the PCB, ensuring reliable electrical contact and mechanical stability.

No. of Ports: 2

Having 2 ports enables simultaneous communication or data transfer between different devices, increasing the versatility and functionality of the bus driver or transceiver.

Maximum Seated Height: 0.4 mm

The low maximum seated height of 0.4mm helps in maintaining a slim profile and compact size, making it suitable for applications with limited vertical space.

Width: 1 mm

The narrow width of 1mm allows for efficient space utilization on the PCB, enabling compact and densely populated circuit designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation and compatibility with standard bus communication protocols, enhancing interoperability and ease of integration.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures reliable operation even under low power conditions, making it suitable for battery-powered or energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40s ensures proper soldering and assembly process, contributing to the overall reliability and performance of the component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables robust soldering and mechanical bonding, ensuring long-term durability and stability in various operating conditions.

Length: 1.95 mm

The compact length of 1.95mm contributes to a small overall footprint on the PCB, enabling efficient space utilization and compact system designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures high reliability, durability, and performance under extreme temperature conditions, making it suitable for rugged applications and harsh environments.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and industry standards, ensuring safe and eco-friendly operation of the component.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for precise connections and compact layout on the PCB, facilitating high-density integration and efficient signal routing.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a wide operating voltage range, ensuring compatibility with different power sources and flexibility in system design.

Technical Specifications

Bus Driver & Transceivers 7WB3125AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1 mm

Trade Compliance

7WB3125AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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