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7WB3126CMX1TCG

Onsemi

7WB3126CMX1TCG by Onsemi

7WB3126CMX1TCG by Onsemi is a Bus Driver & Transceiver with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 0.25 ns and supports a supply voltage range of 4-5.5 V. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.199

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

6,000

-

$0.225

$0.186

$0.166

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

6,000

-

-

-

$0.190

Farnell

UK . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.160

6,000

-

-

-

$0.160

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

6,000

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,449 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,449

$0.160

-

-

-

Digiode

USA . 616 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

616

$0.175

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 208 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

208

$0.160

-

-

-

Corphita

USA . 1,099 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$0.166

-

-

-

Native Components

USA . 182 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

182

$0.166

-

-

$0.159

Northwest PG Solutions

USA . 3 parts In-Stock

1+ parts

$0.182

100+ parts

-

1k+ parts

-

10k+ parts

$0.161

3

$0.182

-

-

$0.161

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.165

10k+ parts

-

6,000

-

-

$0.165

-

TANS Electronics

Latvia . 3,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,834

-

-

-

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SupplyDigital Components

Austria . 2,859 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,859

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-

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Problanco Electronics

Mexico . 2,431 parts In-Stock

1+ parts

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100+ parts

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2,431

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-

-

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Kulean Microsystems

USA . 563 parts In-Stock

1+ parts

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100+ parts

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563

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UHIMA Technologies

Türkiye . 535 parts In-Stock

1+ parts

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535

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Microchip USA

USA . 294 parts In-Stock

1+ parts

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294

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Overview

Elevate your electronic designs with the 7WB3126CMX1TCG bus driver & transceiver by Onsemi. Crafted with precision and expertise, this small outline package offers cutting-edge technology and unparalleled quality, making it a top choice for various applications. From data communication to industrial automation, this versatile component delivers outstanding performance and reliability. Trust Onsemi to provide you with a product that exceeds expectations, offering value, benefits, and advantages that will elevate your projects to new heights. Choose innovation, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceiver.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the bus driver & transceiver on PCBs, saving space and reducing assembly time.

No. of Functions: 2

With 2 functions in one device, this bus driver & transceiver offers versatility and efficiency in managing data transmission and reception.

Package Shape: RECTANGULAR

The rectangular package shape helps in maximizing space utilization on the PCB and allows for efficient placement of the bus driver & transceiver.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and reliable performance of the bus driver & transceiver within the specified operating range.

No. of Terminals: 8

Having 8 terminals enables the bus driver & transceiver to easily interface with other components, devices, or systems for seamless communication.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness and space-saving benefits, making it suitable for applications with limited board space.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25 nanoseconds ensures fast and efficient data transmission, ideal for high-speed communication systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this bus driver & transceiver can withstand harsh environmental conditions and maintain reliable performance.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signal, allowing for efficient data transfer management in different scenarios.

Minimum Operating Temperature: -55 °C

The minimum operating temperature of -55 °C ensures reliable performance even in extreme cold conditions, making the bus driver & transceiver suitable for a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish offers corrosion resistance and ensures optimal signal conductivity, enhancing the overall reliability of the bus driver & transceiver.

Terminal Position: DUAL

The dual terminal position facilitates easy connection and installation of the bus driver & transceiver, providing convenience and flexibility during assembly.

No. of Ports: 2

Having 2 ports allows for simultaneous data transmission and reception, enabling efficient communication between multiple devices or systems.

Maximum Seated Height: 0.4 mm

With a maximum seated height of 0.4mm, this compact bus driver & transceiver can be installed in space-constrained applications without compromising performance.

Width: 1 mm

The slender width of 1mm allows for efficient PCB layout and placement of the bus driver & transceiver in crowded board designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and reception, minimizing errors and enhancing the overall reliability of the bus driver & transceiver.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures reliable operation of the bus driver & transceiver, even under low power conditions, making it suitable for energy-efficient applications.

Length: 1.45 mm

The compact length of 1.45mm allows for easy integration of the bus driver & transceiver in tight spaces, offering flexibility in design and installation.

Temperature Grade: MILITARY

With a military-grade temperature rating, this bus driver & transceiver is designed to withstand demanding conditions and deliver high performance in extreme environments.

Terminal Form: NO LEAD

The no-lead terminal form ensures easy and reliable soldering during assembly, enhancing the overall durability and longevity of the bus driver & transceiver.

Terminal Pitch: 0.35 mm

The small terminal pitch of 0.35mm allows for close spacing of terminals on the PCB, enabling high-density board layouts and efficient signal routing.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility in power supply options for the bus driver & transceiver, accommodating a wide range of voltage requirements in different applications.

Technical Specifications

Bus Driver & Transceivers 7WB3126CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7WB3126CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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