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7WB3305AMX1TCG

Onsemi

7WB3305AMX1TCG by Onsemi

The Onsemi 7WB3305AMX1TCG is a Bus Driver & Transceiver with 2 functions, operating at -55 to 125 °C. It has a propagation delay of 0.25 ns and operates on a supply voltage range of 4-5.5 V. Ideal for military-grade applications requiring fast signal transmission in compact spaces.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

9,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

9,000

-

-

-

$0.200

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

9,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 276 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$0.158

-

-

-

Digiode

USA . 1,738 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

$0.185

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 484 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$0.158

-

-

-

Corphita

USA . 315 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

315

$0.176

-

-

-

Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.175

10k+ parts

-

9,000

-

-

$0.175

-

QUARKTWIN TECHNOLOGY LTD

USA . 8,981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,981

-

-

-

-

SupplyDigital Components

Austria . 7,510 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,510

-

-

-

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TANS Electronics

Latvia . 7,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,305

-

-

-

-

Kulean Microsystems

USA . 6,667 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,667

-

-

-

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Problanco Electronics

Mexico . 4,623 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,623

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-

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Northwest PG Solutions

USA . 1,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,900

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-

-

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Native Components

USA . 710 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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710

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UHIMA Technologies

Türkiye . 227 parts In-Stock

1+ parts

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227

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-

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Microchip USA

USA . 108 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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108

-

-

-

-

Overview

Elevate your electronic designs with the 7WB3305AMX1TCG by Onsemi, a top-of-the-line bus driver and transceiver that offers unparalleled quality and reliability. With Onsemi's reputation for excellence in the industry, you can trust that this product will exceed your expectations. Ideal for a range of applications, this device provides seamless communication between components, ensuring optimal performance. Experience the value and benefits of this innovative solution, designed to streamline your projects and enhance overall efficiency. Choose Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and heat resistance, making the product suitable for various environments and applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and improving overall reliability.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, simplifying design and reducing costs.

Nominal Supply Voltage / Vsup (V): 4.5

Operating within the nominal supply voltage range ensures optimal performance and stability.

No. of Terminals: 8

Sufficient terminals for connectivity options and flexibility in circuit design.

Propagation Delay (tpd): 0.25 ns

Low propagation delay allows for fast signal transmission, improving overall efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh conditions and extended use.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature environments, making it versatile for various industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

No. of Ports: 2

Having multiple ports allows for versatile connectivity options and potential for expanding system capabilities.

Temperature Grade: MILITARY

Meeting military-grade standards ensures high performance and reliability in demanding applications.

Technical Specifications

Bus Driver & Transceivers 7WB3305AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1 mm

Trade Compliance

7WB3305AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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