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7WB3306BMX1TCG

Onsemi

7WB3306BMX1TCG by Onsemi

The Onsemi 7WB3306BMX1TCG is a Bus Driver & Transceiver with 2 bits, 0.25 ns propagation delay, and TRUE output polarity. It is used in military-grade applications requiring a nominal voltage of 4.5V, operating b/w -55 to 125 °C, and featuring a very thin profile grid array package style.

Median Price

$0.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

6,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.200

6,000

-

-

-

$0.200

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

6,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 337 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$0.158

-

-

-

Digiode

USA . 989 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

989

$0.185

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 411 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

411

$0.158

-

-

-

Corphita

USA . 739 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

739

$0.176

-

-

-

Native Components

USA . 758 parts In-Stock

1+ parts

$12.290

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$12.290

-

-

-

Northwest PG Solutions

USA . 595 parts In-Stock

1+ parts

$13.519

100+ parts

$12.167

1k+ parts

-

10k+ parts

-

595

$13.519

$12.167

-

-

TANS Electronics

Latvia . 7,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,139

-

-

-

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Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.175

10k+ parts

-

6,000

-

-

$0.175

-

Problanco Electronics

Mexico . 3,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,699

-

-

-

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SupplyDigital Components

Austria . 3,667 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,667

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-

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Kulean Microsystems

USA . 3,235 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,235

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-

-

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UHIMA Technologies

Türkiye . 484 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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484

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Microchip USA

USA . 326 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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326

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-

Overview

Enhance your electronic designs with the 7WB3306BMX1TCG by Onsemi, a top-tier manufacturer known for their superior quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, offering seamless communication between devices with its advanced features. With a compact rectangular package and ultra-thin profile, this product provides exceptional performance while saving space in your designs. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations. Upgrade your projects today with the 7WB3306BMX1TCG and experience the difference in quality and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

No. of Bits: 2

Having 2 bits allows for simple and efficient communication between components or systems, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V supply voltage is commonly used in many electronic devices, ensuring compatibility and reliability.

Propagation Delay (tpd): 0.25 ns

With a low propagation delay of 0.25 ns, this bus driver & transceiver can quickly transmit signals, ideal for high-speed communication.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55 to 125 °C makes this product suitable for use in harsh environments or extreme conditions.

Width: 1 mm

The compact width of 1mm allows for a space-saving design, making it ideal for applications where size constraints are a concern.

Output Polarity: TRUE

The true output polarity ensures reliable signal transmission and compatibility with other components in the system.

Temperature Grade: MILITARY

The military-grade temperature rating indicates that this product meets stringent requirements for reliability and durability in demanding applications.

Technical Specifications

Bus Driver & Transceivers 7WB3306BMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

3306

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e4

Length:

1.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

7WB3306BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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