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3LN04SS

Onsemi

3LN04SS by Onsemi

3LN04SS by Onsemi is a N-CHANNEL FET with 0.35A max drain current and 0.15W max power dissipation. Ideal for applications requiring enhancement mode operation, such as power management in electronics. Operating up to 150 °C, it's a surface mount device suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,971 parts In-Stock

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Vyrian

USA . 811 parts In-Stock

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Native Components

USA . 48 parts In-Stock

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$1.946

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Northwest PG Solutions

USA . 1,402 parts In-Stock

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$2.140

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Problanco Electronics

Mexico . 7,412 parts In-Stock

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SupplyDigital Components

Austria . 7,085 parts In-Stock

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TANS Electronics

Latvia . 1,156 parts In-Stock

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Corphita

USA . 1,007 parts In-Stock

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Kulean Microsystems

USA . 901 parts In-Stock

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UHIMA Technologies

Türkiye . 297 parts In-Stock

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Corohmni

South Africa . 59 parts In-Stock

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Overview

Unleash the power of innovation with the 3LN04SS by Onsemi! Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled reliability and performance. Ideal for a variety of applications, from automotive to industrial, this SINGLE configuration transistor operates in ENHANCEMENT MODE, delivering maximum efficiency and power dissipation. Trust Onsemi's METAL-OXIDE SEMICONDUCTOR technology to elevate your projects to new heights. Experience the value and benefits of cutting-edge technology with the 3LN04SS - the ultimate choice for forward-thinking customers.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product a good choice for many applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and integrate into circuits, making this product easier to work with.

Surface Mount: YES

Surface mount FETs are compact and suitable for modern PCB designs, making this product a good choice for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching behavior, making this product ideal for precision applications.

Maximum Drain Current (Abs) (ID): 0.35 A

With a maximum drain current of 0.35 A, this FET can handle moderate power levels, suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 0.15 W

The low power dissipation of 0.15 W indicates that this FET operates efficiently and can help in minimizing heat generation in the circuit.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance characteristics, reliability, and low gate capacitance, making this product a desirable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can operate reliably even in high-temperature environments, increasing its versatility.

Maximum Drain Current (ID): 0.35 A

The maximum drain current of 0.35 A further emphasizes the FET's ability to handle current effectively, making it suitable for diverse circuit requirements.

Technical Specifications

Power Field Effect Transistors (FET) 3LN04SS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.35 A

Maximum Drain Current (ID):

.35 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

3LN04SS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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