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3LN03M-TL-E

Onsemi

3LN03M-TL-E by Onsemi

3LN03M-TL-E by Onsemi is a N-CHANNEL FET with 0.35A max drain current and 0.15W power dissipation. Suitable for enhancement mode operation, it has a max operating temp of 150 °C. Ideal for surface mount applications in various electronic devices.

Median Price

$0.211

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 159,000 parts In-Stock

1+ parts

-

100+ parts

$0.211

1k+ parts

$0.175

10k+ parts

$0.156

159,000

-

$0.211

$0.175

$0.156

DigiKey

USA . 159,000 parts In-Stock

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$0.260

159,000

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$0.260

Verical

USA . 99,000 parts In-Stock

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$0.195

99,000

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$0.195

Distributors (In-Stock)

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Digiode

USA . 1,089 parts In-Stock

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$0.164

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1,089

$0.164

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Vyrian

USA . 147 parts In-Stock

1+ parts

$0.173

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147

$0.173

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DigiKey Marketplace

USA . 1,987 parts In-Stock

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$0.180

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1,987

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$0.180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 24 parts In-Stock

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$0.155

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24

$0.155

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Corphita

USA . 1,914 parts In-Stock

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$0.156

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1,914

$0.156

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Advanced Electronics

New Zealand . 46 parts In-Stock

1+ parts

$1.289

100+ parts

$1.173

1k+ parts

$1.057

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46

$1.289

$1.173

$1.057

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Continental Prestige Electronics

USA . 159,000 parts In-Stock

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$0.159

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$0.159

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Kepictronics

USA . 72,540 parts In-Stock

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Problanco Electronics

Mexico . 7,846 parts In-Stock

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TANS Electronics

Latvia . 7,308 parts In-Stock

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SupplyDigital Components

Austria . 4,098 parts In-Stock

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Kulean Microsystems

USA . 2,645 parts In-Stock

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Northwest PG Solutions

USA . 1,814 parts In-Stock

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UHIMA Technologies

Türkiye . 865 parts In-Stock

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865

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Native Components

USA . 535 parts In-Stock

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535

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Overview

Unlock the power of efficient energy management with the 3LN03M-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With its N-CHANNEL polarity and SINGLE configuration, this transistor offers enhanced performance and reliability. Say goodbye to overheating issues with a maximum power dissipation of 0.15W and enjoy seamless operation even at high temperatures up to 150 °C. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their low ON resistance and high switching speeds, making this product a good choice for applications requiring efficient power switching.

Configuration: SINGLE

Single configuration FETs are simple to use and reliable, making them suitable for various applications where a single channel is needed.

Surface Mount: YES

Surface mount FETs are easy to integrate into compact circuit designs, making this product ideal for space-constrained applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally-off devices, providing better control and safety in circuits compared to depletion mode FETs.

Maximum Drain Current (Abs) (ID): 0.35 A

With a maximum drain current of 0.35 A, this FET can handle moderate power requirements effectively, making it suitable for a range of low to medium power applications.

Maximum Power Dissipation (Abs): 0.15 W

The low maximum power dissipation of 0.15 W indicates that this FET operates efficiently and can be used in circuits where power management is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics, such as high input impedance and low output capacitance, making this FET a reliable choice for signal amplification and switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures, making it suitable for harsh environments or applications where heat dissipation is critical.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability, ensuring easy installation and reliable connections in the circuit, making this FET a convenient choice for assembly.

Technical Specifications

Power Field Effect Transistors (FET) 3LN03M-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.35 A

Maximum Drain Current (ID):

.35 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

3LN03M-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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