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3LN04S

Onsemi

3LN04S by Onsemi

3LN04S by Onsemi is a N-CHANNEL FET with 0.35A max drain current and 0.15W max power dissipation. Suitable for enhancement mode operation, it's ideal for applications requiring surface mount technology in high temperature environments up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,404 parts In-Stock

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Vyrian

USA . 1,517 parts In-Stock

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Native Components

USA . 609 parts In-Stock

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$18.066

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609

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Northwest PG Solutions

USA . 2,074 parts In-Stock

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$19.873

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$17.886

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SupplyDigital Components

Austria . 6,606 parts In-Stock

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TANS Electronics

Latvia . 842 parts In-Stock

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UHIMA Technologies

Türkiye . 542 parts In-Stock

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Corphita

USA . 497 parts In-Stock

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Problanco Electronics

Mexico . 413 parts In-Stock

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Kulean Microsystems

USA . 231 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Unleash the power of innovation with the 3LN04S N-CHANNEL Power Field Effect Transistor by Onsemi. This high-quality component offers enhanced performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this transistor provides efficient power management and superior functionality. Experience the benefits of Onsemi's cutting-edge technology and unlock endless possibilities with the 3LN04S.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer lower ON-state resistance and higher current-carrying capability, making them suitable for high power applications.

Configuration: SINGLE

Single configuration simplifies circuit design and reduces component count, making the product suitable for compact applications.

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and enabling automated assembly processes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are turned on by a positive gate voltage, providing better control and efficiency in circuits.

Maximum Drain Current (Abs) (ID): 0.35 A

High maximum drain current rating allows the FET to handle higher power loads, making it suitable for applications requiring more current.

Maximum Power Dissipation (Abs): 0.15 W

Low power dissipation ensures efficient operation and prevents overheating, increasing the reliability of the product.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer good performance characteristics such as high efficiency and reliability, making them a popular choice for various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows the FET to withstand elevated temperature environments, enhancing its robustness and versatility.

Maximum Drain Current (ID): 0.35 A

Consistent with previous spec mentioned above, this maximum drain current rating reinforces the FET's ability to handle high current loads, making it a reliable choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) 3LN04S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

.35 A

Maximum Drain Current (ID):

.35 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

3LN04S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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