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TFF11096HN/N1X

NXP Semiconductors

TFF11096HN/N1X by NXP Semiconductors

TFF11096HN/N1X from NXP Semiconductors is a robust clock driver designed for industrial applications. It operates at a nominal voltage of 3.3V, supports up to 1A output current, and functions effectively in temperatures ranging from -40 °C to 85 °C. Its compact no-lead design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,301 parts In-Stock

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7,301

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Digiode

USA . 1,664 parts In-Stock

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1,664

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Anansix

USA . 962 parts In-Stock

1+ parts

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962

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,488 parts In-Stock

1+ parts

$8.938

100+ parts

-

1k+ parts

$8.580

10k+ parts

$8.580

1,488

$8.938

-

$8.580

$8.580

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$13.751

100+ parts

$12.513

1k+ parts

$11.276

10k+ parts

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270

$13.751

$12.513

$11.276

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AZTECH Wire

Italy . 102 parts In-Stock

1+ parts

$14.320

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102

$14.320

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Microchip USA

USA . 303 parts In-Stock

1+ parts

$19.889

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303

$19.889

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One Stop Electronics

USA . 1,460 parts In-Stock

1+ parts

$46.000

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1,460

$46.000

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UNI Independent Distributors

Spain . 7,843 parts In-Stock

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7,843

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Corphita

USA . 4,776 parts In-Stock

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4,776

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Overview

Elevate your designs with the TFF11096HN/N1X from NXP Semiconductors, a leader in innovation and quality. This cutting-edge clock driver excels in reliability and performance, making it ideal for industrial applications where precision is paramount. Its robust temperature range and compact design ensure seamless integration and longevity, empowering you to create efficient systems that meet demanding standards. Choose NXP for unmatched value and peace of mind in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, ensuring a longer lifespan for the device.

Surface Mount: YES

Being surface mount allows for a compact design, making it suitable for high-density applications and saving board space.

Package Shape: SQUARE

The square package shape is beneficial for thermal management and efficient routing on PCB layouts.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this product is ideal for systems that operate at low voltage, reducing power consumption.

Power Supplies (V): 3.3

Compatible with standard power supplies of 3.3V, it simplifies integration into existing circuits.

No. of Terminals: 24

Having 24 terminals provides multiple connection options for flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and reliability in various applications.

Maximum I (ol): 1 Amp

With a maximum output current of 1 Amp, this product can handle a variety of load conditions efficiently.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C makes this device suitable for industrial applications with harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold (down to -40 °C) broadens the application range in outdoor or unconditioned environments.

Terminal Position: QUAD

The quad terminal position simplifies layout and soldering, enhancing assembly efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with various soldering processes, ensuring robust assembly.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures reliability and durability for demanding applications.

Terminal Form: NO LEAD

No lead design promotes a compact profile and is environmentally friendly, aligning with RoHS standards.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density packaging, enabling the inclusion of more features in limited space.

Technical Specifications

Clock Drivers & Buffers TFF11096HN/N1X attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF11096HN/N1X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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