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TFF11152HN/N1,111

NXP Semiconductors

TFF11152HN/N1,111 by NXP Semiconductors

TFF11152HN/N1,111 from NXP Semiconductors is a robust clock driver designed for industrial applications. It operates at a nominal voltage of 3.3V, supports up to 1A output current, and functions effectively in temperatures ranging from -40 °C to 85 °C. Its compact no-lead design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,492 parts In-Stock

1+ parts

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4,492

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Anansix

USA . 2,593 parts In-Stock

1+ parts

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2,593

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Digiode

USA . 1,607 parts In-Stock

1+ parts

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1,607

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 512 parts In-Stock

1+ parts

$3.901

100+ parts

-

1k+ parts

$3.745

10k+ parts

$3.745

512

$3.901

-

$3.745

$3.745

AZTECH Wire

Italy . 1,088 parts In-Stock

1+ parts

$14.260

100+ parts

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1,088

$14.260

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Microchip USA

USA . 6,516 parts In-Stock

1+ parts

$36.344

100+ parts

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6,516

$36.344

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One Stop Electronics

USA . 884 parts In-Stock

1+ parts

$55.000

100+ parts

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884

$55.000

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Component Stockers USA

USA . 544 parts In-Stock

1+ parts

$99.990

100+ parts

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544

$99.990

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UNI Independent Distributors

Spain . 6,780 parts In-Stock

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6,780

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Corphita

USA . 495 parts In-Stock

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495

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Overview

Unlock precision and reliability with the TFF11152HN/N1,111 from NXP Semiconductors. Designed for robust clock driving applications, this high-quality component excels in demanding environments, ensuring top-notch performance across a range of industrial settings. With its compact design and low power consumption, it not only enhances efficiency but also delivers long-lasting value. Trust NXP to elevate your projects with innovation that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this clock driver suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern printed circuit boards, enhancing design flexibility.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, allowing for efficient layout and higher density designs.

Nominal Supply Voltage / Vsup (V): 3.3

A nominal supply voltage of 3.3V makes this product compatible with a wide range of digital circuits, ensuring versatility.

Power Supplies (V): 3.3

Operating at 3.3V aligns with standard low-voltage logic levels, which is critical for power-sensitive applications.

No. of Terminals: 24

With 24 terminals, this device provides multiple I/O options, enhancing connectivity for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient thermal management and electrical performance in high-frequency applications.

Maximum I (ol): 1 Amp

A maximum output current of 1 Amp allows this driver to support demanding applications while maintaining performance.

Maximum Operating Temperature: 85 °C

Rated for a maximum temperature of 85 °C ensures reliability and performance in challenging thermal environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver is suitable for industrial and outdoor applications where extreme temperatures are encountered.

Terminal Position: QUAD

Quad terminal positioning facilitates easy routing and minimizes PCB space usage, promoting design efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees that the product meets rigorous standards for reliability in demanding environments.

Terminal Form: NO LEAD

No lead terminals contribute to a reduction in overall package height, allowing for slimmer designs and better soldering performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high-density placement on PCBs, making it ideal for space-constrained applications.

Technical Specifications

Clock Drivers & Buffers TFF11152HN/N1,111 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF11152HN/N1,111 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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