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TFF11096HN/N1,111

NXP Semiconductors

TFF11096HN/N1,111 by NXP Semiconductors

NXP Semiconductors TFF11096HN/N1,111 is a clock driver in PLASTIC/EPOXY package with 24 terminals. Operates at -40 to 85 °C with Vsup of 3.3V. Suitable for industrial applications requiring high I (ol) of 1A and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,814 parts In-Stock

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Digiode

USA . 4,228 parts In-Stock

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Anansix

USA . 1,181 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Andel Nordic

Denmark . 1,974 parts In-Stock

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$8.958

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$8.599

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$8.599

1,974

$8.958

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$8.599

$8.599

AZTECH Wire

Italy . 853 parts In-Stock

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$19.077

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853

$19.077

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$19.540

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$17.781

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$16.023

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$19.540

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Microchip USA

USA . 325 parts In-Stock

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$22.386

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325

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One Stop Electronics

USA . 640 parts In-Stock

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$34.000

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UNI Independent Distributors

Spain . 6,963 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,218 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 646 parts In-Stock

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Overview

Elevate your electronics with the TFF11096HN/N1,111 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors delivers clock drivers & buffers that are unmatched in performance. Perfect for a wide range of applications, this product offers customers unparalleled value and benefits. Say goodbye to inefficiencies and hello to seamless operations with the TFF11096HN/N1,111. Experience the advantages of cutting-edge technology without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and long-lasting performance of the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a wide range of electronic devices that operate on a 3.3V power supply.

Maximum I (ol): 1 Amp

Capable of handling high current outputs, making it suitable for driving clock signals with ease.

Maximum Operating Temperature: 85 °C

Can operate reliably even in high-temperature environments, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

Designed to function effectively in low-temperature conditions, making it versatile for various applications.

Technical Specifications

Clock Drivers & Buffers TFF11096HN/N1,111 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF11096HN/N1,111 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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