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TFF1003HN/N1,115

NXP Semiconductors

TFF1003HN/N1,115 by NXP Semiconductors

TFF1003HN/N1,115 by NXP Semiconductors is a robust clock driver with a 3.3V supply and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 24-terminal quad package and supports up to 1A output current. Ideal for industrial applications requiring reliable timing solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,367 parts In-Stock

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3,367

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Vyrian

USA . 2,424 parts In-Stock

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2,424

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Bristol Electronics

USA . 1,283 parts In-Stock

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1,283

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Anansix

USA . 1,268 parts In-Stock

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1,268

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Distributors (Availability)

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Andel Nordic

Denmark . 3,399 parts In-Stock

1+ parts

$1.725

100+ parts

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$1.656

10k+ parts

$1.656

3,399

$1.725

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$1.656

$1.656

AZTECH Wire

Italy . 501 parts In-Stock

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$10.490

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501

$10.490

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One Stop Electronics

USA . 1,102 parts In-Stock

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$14.000

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1,102

$14.000

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Microchip USA

USA . 452 parts In-Stock

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$37.108

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452

$37.108

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Component Stockers USA

USA . 438 parts In-Stock

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$99.990

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438

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Corphita

USA . 2,138 parts In-Stock

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2,138

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UNI Independent Distributors

Spain . 1,853 parts In-Stock

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Overview

Elevate your designs with the TFF1003HN/N1,115 from NXP Semiconductors—where innovation meets reliability. This high-performance clock driver and buffer seamlessly integrates into various applications, ensuring precision and stability even in the most demanding environments. With a robust design tailored for industrial use, it delivers exceptional value and efficiency, empowering you to create cutting-edge solutions that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure reliability and longevity in various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space and automation in assembly.

Package Shape: SQUARE

The square shape optimizes board space and layout flexibility.

Nominal Supply Voltage / Vsup: 3.3V

Standard voltage level ensures compatibility with various electronic circuits.

Power Supplies: 3.3V

Works seamlessly with modern low-voltage power supply designs, enhancing energy efficiency.

No. of Terminals: 24

A sufficient number of terminals enables diverse functionality and connectivity options.

Package Style: CHIP CARRIER

Chip carrier style aids in better thermal performance and ease of assembly.

Maximum I (ol): 1 Amp

The ability to handle 1 Amp current ensures robust performance in high-power applications.

Maximum Operating Temperature: 85 °C

High temperature tolerance supports operation in demanding environments without failure.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance in extreme conditions.

Terminal Position: QUAD

Quadrant terminal positioning simplifies PCB design and layout considerations.

Peak Reflow Temperature: 260 °C

The high reflow temperature capability ensures compatibility with various soldering processes.

Temperature Grade: INDUSTRIAL

Industrial specification indicates high reliability suitable for critical applications.

Terminal Form: NO LEAD

No lead design contributes to a smaller footprint and environmentally friendly production.

Packing Method: TR, 7 INCH

Preservation in a tape and reel system allows for easy handling and automated assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for compact circuit designs while maintaining excellent performance.

Technical Specifications

Clock Drivers & Buffers TFF1003HN/N1,115 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF1003HN/N1,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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