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TFF1003HN/N1,118

NXP Semiconductors

TFF1003HN/N1,118 by NXP Semiconductors

TFF1003HN/N1,118 by NXP Semiconductors is a robust clock driver with a 3.3V supply and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 24-terminal chip carrier design and supports up to 1A output current. Ideal for industrial applications requiring reliable timing solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,384 parts In-Stock

1+ parts

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8,384

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Digiode

USA . 3,864 parts In-Stock

1+ parts

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3,864

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Anansix

USA . 1,601 parts In-Stock

1+ parts

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1,601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,762 parts In-Stock

1+ parts

$8.112

100+ parts

-

1k+ parts

$7.788

10k+ parts

$7.788

2,762

$8.112

-

$7.788

$7.788

One Stop Electronics

USA . 379 parts In-Stock

1+ parts

$14.000

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379

$14.000

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AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$21.570

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403

$21.570

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QUARKTWIN TECHNOLOGY LTD

USA . 10,817 parts In-Stock

1+ parts

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10,817

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Microchip USA

USA . 6,625 parts In-Stock

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6,625

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Corphita

USA . 594 parts In-Stock

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594

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UNI Independent Distributors

Spain . 541 parts In-Stock

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541

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Overview

Elevate your designs with the TFF1003HN/N1,118 from NXP Semiconductors—a leader in innovation and reliability. With its robust performance in clock driving and buffering, this versatile chip ensures accuracy and stability across industrial applications, even in extreme temperatures. Benefit from a compact, surface-mount design that simplifies integration while boosting efficiency, making it the smart choice for engineers seeking quality and dependability in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental stress, making it suitable for long-term applications.

Surface Mount: YES

Surface mount technology allows for a compact design, promoting efficient utilization of PCB space.

Package Shape: SQUARE

The square package shape offers symmetrical mounting properties, enhancing thermal performance and electrical reliability.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with a wide range of low-voltage digital circuits.

Power Supplies (V): 3.3

The 3.3V power supply ensures efficient power consumption and compatibility with modern electronic devices.

No. of Terminals: 24

With 24 terminals, this product offers ample connection options for complex circuit designs without compromising on performance.

Package Style (Meter): CHIP CARRIER

The chip carrier style facilitates easy integration onto PCBs, enhancing manufacturing efficiency and reducing assembly errors.

Maximum I (ol): 1 Amp

A maximum output current capability of 1 Amp allows for driving loads effectively, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures reliability in high-temperature environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range from -40 °C makes this product suitable for industrial and outdoor applications.

Terminal Position: QUAD

Having a quad terminal position allows for efficient routing on PCBs, minimizing signal interference and improving performance.

Peak Reflow Temperature °C: 260

The maximum reflow temperature of 260 °C ensures compatibility with lead-free soldering processes, adhering to modern manufacturing standards.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product meets rigorous standards for durability and reliability in demanding environments.

Terminal Form: NO LEAD

No lead construction reduces the overall footprint and improves PCB layout flexibility while being environmentally friendly.

Packing Method: TR, 13 INCH

The tape and reel packing method promotes automated assembly processes, enhancing production efficiency and reducing labor costs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact designs while enabling high-density circuit layouts, perfect for modern electronics.

Technical Specifications

Clock Drivers & Buffers TFF1003HN/N1,118 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF1003HN/N1,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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