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TFF11152HN

NXP Semiconductors

TFF11152HN by NXP Semiconductors

PLL BASED CLOCK DRIVER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Shape: SQUARE; Qualification: Not Qualified; Terminal Position: QUAD;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,291

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-

-

-

Vyrian

USA . 1,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,309

-

-

-

-

Anansix

USA . 1,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,236

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,187 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

$1.164

10k+ parts

$1.164

3,187

$1.660

-

$1.164

$1.164

One Stop Electronics

USA . 413 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

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10k+ parts

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413

$17.000

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Corphita

USA . 4,690 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,690

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-

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UNI Independent Distributors

Spain . 1,747 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,747

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Technical Specifications

Clock Drivers & Buffers TFF11152HN attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Logic IC Type:

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

TFF11152HN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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