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TFF11096HN/N1,118

NXP Semiconductors

TFF11096HN/N1,118 by NXP Semiconductors

TFF11096HN/N1,118 from NXP Semiconductors is a robust clock driver designed for industrial applications. It operates at a nominal voltage of 3.3V, supports up to 1A output current, and functions effectively in temperatures ranging from -40 °C to 85 °C. Its compact chip carrier design ensures efficient surface mounting in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,337 parts In-Stock

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2,337

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Vyrian

USA . 1,171 parts In-Stock

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1,171

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Digiode

USA . 399 parts In-Stock

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399

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 116 parts In-Stock

1+ parts

$22.134

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116

$22.134

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Ampacity Inc.

Singapore . 1,232 parts In-Stock

1+ parts

$46.000

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1,232

$46.000

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One Stop Electronics

USA . 575 parts In-Stock

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$65.000

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575

$65.000

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Corphita

USA . 2,967 parts In-Stock

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2,967

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UNI Independent Distributors

Spain . 822 parts In-Stock

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822

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Overview

Elevate your designs with the TFF11096HN/N1,118 from NXP Semiconductors, a leader in innovative technology. This advanced clock driver and buffer combines exceptional reliability with compact design, perfect for industrial applications. With its robust performance across extreme temperatures, it ensures seamless operation. Trust in NXP’s commitment to quality and unlock enhanced efficiency and precision for your projects—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount design allows for efficient board space utilization and simplifies automated assembly processes.

Package Shape: SQUARE

The square package shape contributes to a compact design, beneficial for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this product compatible with a wide variety of modern electronic devices.

Power Supplies (V): 3.3

The product's power supply requirement of 3.3V ensures energy efficiency and compatibility with standard low-voltage systems.

No. of Terminals: 24

With 24 terminals, this product provides ample connectivity options for versatile circuit configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging facilitates better heat dissipation and reliability in high-performance applications.

Maximum I (ol): 1 Amp

Supporting a maximum output current of 1 Amp allows for driving various loads effectively, enhancing its functionality.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is suitable for industrial applications where heat tolerance is essential.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures reliable performance in extreme environments, extending its application range.

Terminal Position: QUAD

Quad terminal positioning provides a robust and stable connection, ensuring reliability in the device's operation.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with advanced manufacturing processes, ensuring high-quality solder joints.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures the product meets stringent standards for longevity and reliability in demanding environments.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's eco-friendliness and supports efficient assembly in automated systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for a compact layout, making it an ideal choice for high-density circuit designs.

Technical Specifications

Clock Drivers & Buffers TFF11096HN/N1,118 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF11096HN/N1,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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