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TFF11092HN/N1,115

NXP Semiconductors

TFF11092HN/N1,115 by NXP Semiconductors

TFF11092HN/N1,115 from NXP Semiconductors is a robust clock driver designed for industrial applications. It operates at a nominal voltage of 3.3V, supports up to 1A output current, and functions effectively in temperatures ranging from -40 °C to 85 °C. Its compact chip carrier design ensures efficient surface mounting for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,107 parts In-Stock

1+ parts

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4,107

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Vyrian

USA . 4,026 parts In-Stock

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4,026

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Anansix

USA . 94 parts In-Stock

1+ parts

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94

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 943 parts In-Stock

1+ parts

$6.503

100+ parts

-

1k+ parts

$6.243

10k+ parts

$6.243

943

$6.503

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$6.243

$6.243

One Stop Electronics

USA . 1,044 parts In-Stock

1+ parts

$19.000

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1,044

$19.000

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UNI Independent Distributors

Spain . 5,447 parts In-Stock

1+ parts

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5,447

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Corphita

USA . 2,313 parts In-Stock

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2,313

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Overview

Elevate your designs with the TFF11092HN/N1,115 from NXP Semiconductors—a trusted leader in innovative solutions. This high-performance clock driver ensures reliable operation across diverse applications, even in demanding environments, thanks to its robust industrial-grade specifications. Experience enhanced efficiency and stability while enjoying seamless integration into your systems. Choose NXP for quality you can trust and a performance that sets you apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuits, enhancing the product's versatility.

Package Shape: SQUARE

The square shape contributes to efficient space usage on PCB layouts, facilitating higher density designs.

Nominal Supply Voltage / Vsup: 3.3 V

Operational at a 3.3 V supply voltage makes it compatible with most digital systems, ensuring easy integration.

Power Supplies: 3.3 V

Compatible with standardized 3.3 V power supplies, simplifying power management in designs.

No. of Terminals: 24

With 24 terminals, the product offers a sufficient number of connections for complex applications, ensuring flexible functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient heat dissipation and reliable performance in various operating environments.

Maximum I (ol): 1 Amp

Can handle up to 1 Amp of output current, making it suitable for applications requiring considerable power without compromising performance.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C ensures reliability in high-temperature environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C allows for use in extreme conditions, enhancing its appeal in outdoor or harsh environments.

Terminal Position: QUAD

Quad terminal positioning optimizes space and facilitates easier routing on PCBs, improving design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring improved reliability and longevity in demanding conditions.

Terminal Form: NO LEAD

No lead terminals contribute to a smaller footprint, making it easier to fit into compact designs and improving soldering efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density packaging, allowing for smaller and more versatile circuit layouts.

Technical Specifications

Clock Drivers & Buffers TFF11092HN/N1,115 attributes and parameters. Explore more Clock Drivers & Buffers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Maximum I (ol):

1 Amp

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TFF11092HN/N1,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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