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TDA19978AHV/15,557

NXP Semiconductors

TDA19978AHV/15,557 by NXP Semiconductors

TDA19978AHV/15,557 by NXP Semiconductors is a consumer IC designed for surface mount applications. It operates at 1.8V and 3.3V with a max temp of 70 °C, featuring a quad terminal layout in a flatpack package. Ideal for multimedia and audio processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,560 parts In-Stock

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Digiode

USA . 2,518 parts In-Stock

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Anansix

USA . 274 parts In-Stock

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274

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One Stop Electronics

USA . 1,359 parts In-Stock

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$12.800

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1,359

$12.800

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AZTECH Wire

Italy . 431 parts In-Stock

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$21.640

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431

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QUARKTWIN TECHNOLOGY LTD

USA . 9,054 parts In-Stock

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Microchip USA

USA . 6,151 parts In-Stock

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UNI Independent Distributors

Spain . 4,694 parts In-Stock

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Corphita

USA . 4,472 parts In-Stock

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Overview

Unlock a new level of performance with the TDA19978AHV/15,557 from NXP Semiconductors—a leader in innovative semiconductor solutions. Designed for versatility in consumer applications, this advanced IC ensures exceptional quality and reliability. Its compact, flatpack design simplifies integration while delivering optimal power efficiency. Elevate your projects with a trusted partner that offers unmatched support and cutting-edge technology—experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy packaging ensures long-lasting performance and resistance to environmental factors.

Surface Mount: YES

Surface mount capability allows for efficient space-saving designs and simplifies assembly in automated processes.

Package Shape: SQUARE

Square package shape facilitates easier layout on PCBs and enhances thermal performance.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility with a wide range of consumer electronics.

Power Supplies (V): 1.8, 3.3

Dual voltage supply options provide flexibility for various applications and power management needs.

No. of Terminals: 144

A high terminal count enables complex functionalities and connections, supporting advanced circuit designs.

Package Style (Meter): FLATPACK

Flatpack style contributes to a low profile, making it suitable for compact designs in consumer devices.

Maximum Operating Temperature: 70 °C

Withstand high operational temperatures, ensuring reliability in demanding environments.

Minimum Operating Temperature: 0 °C

Operational even in low temperature conditions, making it versatile for various climates.

Terminal Position: QUAD

Quad terminal positioning allows for efficient connections and alignment on circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures adequate performance for everyday consumer applications.

Technology: CMOS

CMOS technology is power-efficient, enabling longer battery life and lower heat generation.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering and reliable electrical connections, enhancing durability.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density layouts, supporting compact and efficient designs.

Technical Specifications

Other Function Consumer ICs TDA19978AHV/15,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA19978AHV/15,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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