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TDA19977AHV/15,557

NXP Semiconductors

TDA19977AHV/15,557 by NXP Semiconductors

TDA19977AHV/15,557 by NXP Semiconductors is a consumer IC in a square flatpack with 144 terminals. It operates at 1.8V and 3.3V, with a max temp of 70 °C. Ideal for surface mount applications, it features CMOS technology for efficient performance.

Median Price

$5.710

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 230 parts In-Stock

1+ parts

-

100+ parts

$4.930

1k+ parts

$4.410

10k+ parts

$4.150

230

-

$4.930

$4.410

$4.150

DigiKey

USA . 230 parts In-Stock

1+ parts

-

100+ parts

$5.710

1k+ parts

$5.710

10k+ parts

$5.710

230

-

$5.710

$5.710

$5.710

Verical

USA . 230 parts In-Stock

1+ parts

-

100+ parts

$6.162

1k+ parts

$5.513

10k+ parts

$5.188

230

-

$6.162

$5.513

$5.188

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,061 parts In-Stock

1+ parts

$5.216

100+ parts

-

1k+ parts

-

10k+ parts

-

1,061

$5.216

-

-

-

Vyrian

USA . 4,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,689

-

-

-

-

Anansix

USA . 2,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,524

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,912 parts In-Stock

1+ parts

$4.941

100+ parts

-

1k+ parts

-

10k+ parts

-

4,912

$4.941

-

-

-

Microchip USA

USA . 452 parts In-Stock

1+ parts

$6.859

100+ parts

-

1k+ parts

-

10k+ parts

-

452

$6.859

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,268 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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23,268

-

-

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UNI Independent Distributors

Spain . 3,595 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,595

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Overview

Unlock unparalleled audio and video performance with the TDA19977AHV/15,557 from NXP Semiconductors. Renowned for its innovation in consumer electronics, NXP delivers cutting-edge technology that enhances multimedia experiences in a compact, reliable package. Perfect for diverse applications—from home theater systems to portable devices—this IC ensures superior signal quality and energy efficiency, empowering you to create next-level products while enjoying long-term durability and support.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure reliability and longevity, making this product suitable for various consumer applications.

Surface Mount: YES

The surface mount capability facilitates easier integration into modern compact designs, saving space on PCBs.

Package Shape: SQUARE

A square package shape allows for efficient space utilization and thermal performance, enhancing overall design flexibility.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronic applications, ensuring compatibility and performance in a wide range of devices.

Power Supplies (V): 1.8, 3.3

Supports dual voltage supply options, making it adaptable for various consumer electronic designs.

No. of Terminals: 144

A higher number of terminals provides extensive connectivity options, allowing for complex functionalities in a single IC.

Package Style (Meter): FLATPACK

The flatpack style offers a low-profile design that is ideal for space-constrained applications and effective thermal management.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for consumer applications that operate in moderate environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature allows for reliable performance in cooler environments, enhancing product versatility.

Terminal Position: QUAD

Quad terminal positioning enables efficient routing on printed circuit boards, improving assembly processes.

Temperature Grade: COMMERCIAL

Commercial grade temperature classification ensures that the device performs reliably in standard consumer conditions.

Technology: CMOS

Using CMOS technology allows for low power consumption and high density, making the IC efficient and effective for consumer devices.

Terminal Form: GULL WING

Gull wing terminals provide a robust connection and easier soldering, improving assembly yield and reliability.

Terminal Pitch: 0.5 mm

A narrower terminal pitch allows for compact designs, enabling more functionalities within smaller footprint devices.

Technical Specifications

Other Function Consumer ICs TDA19977AHV/15,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA19977AHV/15,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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