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TDA18254AHN/C1,557

NXP Semiconductors

TDA18254AHN/C1,557 by NXP Semiconductors

TDA18254AHN/C1,557 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a max supply current of 295mA and supports temperatures from 0 °C to 70 °C. Ideal for compact electronic devices, it features a no-lead design in a square chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,041 parts In-Stock

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Flip Electronics

USA . 1,300 parts In-Stock

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Anansix

USA . 771 parts In-Stock

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Digiode

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Distributors (Availability)

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Microchip USA

USA . 467 parts In-Stock

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$4.411

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AZTECH Wire

Italy . 661 parts In-Stock

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$13.420

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One Stop Electronics

USA . 1,191 parts In-Stock

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$19.800

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UNI Independent Distributors

Spain . 6,078 parts In-Stock

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Corphita

USA . 3,273 parts In-Stock

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Overview

Elevate your designs with the TDA18254AHN/C1,557 from NXP Semiconductors, a leader in innovative solutions. This high-quality consumer IC seamlessly integrates into various applications, delivering reliable performance under demanding conditions. With its robust design and commercial-grade durability, it offers exceptional value, ensuring your projects achieve optimal efficiency and longevity. Trust in NXP's expertise to enhance your products and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into modern PCBs, improving assembly efficiency.

Package Shape: SQUARE

The square package shape facilitates uniform placement on PCB, optimizing space and improving thermal performance.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes this product compatible with most low-power digital circuits.

No. of Terminals: 48

With 48 terminals, this component provides ample connection points for complex functionalities, enhancing versatility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier style is well-suited for high-density applications, allowing for efficient space utilization in electronic designs.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderate heat conditions, suitable for various consumer applications.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this component is designed to function in environments without extreme cold limitations.

Terminal Position: QUAD

The quad terminal position provides a balanced layout for electrical connections, promoting stability and performance consistency.

Peak Reflow Temperature °C: 260

Supporting a peak reflow temperature of 260 °C allows for compatibility with modern soldering processes without risking damage.

Temperature Grade: COMMERCIAL

Rated as commercial grade, this product meets the reliability standards required for consumer electronics, ensuring longevity.

Terminal Form: NO LEAD

No lead terminal form enhances environmental friendliness and compliance with regulations, appealing to eco-conscious consumers.

Maximum Supply Current: 295 mA

A maximum supply current of 295 mA supports a balance between performance and energy efficiency, suitable for a range of applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher density layouts, providing more design flexibility in compact electronic devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is reasonably robust against moisture during handling, reducing risk during assembly.

Technical Specifications

Other Function Consumer ICs TDA18254AHN/C1,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

295 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18254AHN/C1,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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