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TDA18250HN/C1,557

NXP Semiconductors

TDA18250HN/C1,557 by NXP Semiconductors

TDA18250HN/C1,557 by NXP Semiconductors is a compact consumer IC designed for surface mount applications. It operates at 3.3V with a 48-terminal quad configuration and withstands peak reflow temps of 260 °C. Ideal for advanced multimedia systems, it ensures reliable performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,007 parts In-Stock

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3,007

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Anansix

USA . 2,888 parts In-Stock

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2,888

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Digiode

USA . 2,688 parts In-Stock

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2,688

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Distributors (Availability)

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Microchip USA

USA . 2,629 parts In-Stock

1+ parts

$2.112

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2,629

$2.112

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One Stop Electronics

USA . 1,427 parts In-Stock

1+ parts

$10.800

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1,427

$10.800

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AZTECH Wire

Italy . 987 parts In-Stock

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$16.130

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987

$16.130

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UNI Independent Distributors

Spain . 3,463 parts In-Stock

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3,463

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Corphita

USA . 2,571 parts In-Stock

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2,571

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Overview

Unlock the full potential of your electronic designs with the TDA18250HN/C1,557 from NXP Semiconductors! Renowned for their innovation and reliability, NXP delivers this cutting-edge consumer IC that ensures superior performance in various applications. Its compact design and efficient power management make it ideal for modern devices, providing engineers with a seamless integration experience. Elevate your projects today—experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design with efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: SQUARE

A square package shape offers balanced dimensions, facilitating easy placement and soldering on circuit boards.

Power Supplies (V): 3.3V

Operating at 3.3V, this product is compatible with most low-voltage applications, enhancing energy efficiency.

No. of Terminals: 48

With 48 terminals, this IC provides ample connections for versatile functionality, supporting complex designs.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for easy integration into various systems, facilitating efficient thermal and electrical performance.

Terminal Position: QUAD

Quad terminal positioning ensures optimal placement flexibility and signal integrity, which is critical for performance.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with high-temperature soldering processes, ensuring reliable assembly.

Terminal Form: NO LEAD

Having no leads reduces PCB space usage and allows for a lower profile, enhancing design compactness.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs, making it suitable for advanced electronic applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 shows that this product should be handled with care regarding moisture, but it also indicates suitability for standard PCB assembly processes.

Technical Specifications

Other Function Consumer ICs TDA18250HN/C1,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18250HN/C1,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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