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TDA18219HN/C1,557

NXP Semiconductors

TDA18219HN/C1,557 by NXP Semiconductors

TDA18219HN/C1,557 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a -20 °C min temp and features a compact 40-terminal quad package. Ideal for enhancing audio/video performance in electronic devices.

Median Price

$1.396

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,400 parts In-Stock

1+ parts

$3.870

100+ parts

$1.900

1k+ parts

$1.610

10k+ parts

-

2,400

$3.870

$1.900

$1.610

-

Rochester

USA . 580 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$1.070

10k+ parts

$1.010

580

-

$1.200

$1.070

$1.010

DigiKey

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.380

10k+ parts

$1.380

580

-

-

$1.380

$1.380

Verical

USA . 580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.413

10k+ parts

-

580

-

-

$1.413

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,184 parts In-Stock

1+ parts

$1.264

100+ parts

-

1k+ parts

-

10k+ parts

-

1,184

$1.264

-

-

-

Vyrian

USA . 3,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,614

-

-

-

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Anansix

USA . 2,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,317

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,034 parts In-Stock

1+ parts

$1.197

100+ parts

-

1k+ parts

-

10k+ parts

-

3,034

$1.197

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24,509

-

-

-

-

Perfect Parts

USA . 13,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,608

-

-

-

-

UNI Independent Distributors

Spain . 5,181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,181

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-

-

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Microchip USA

USA . 4,884 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,884

-

-

-

-

Authorized Procurement Solutions

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,400

-

-

-

-

GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

-

-

-

-

Overview

Elevate your electronic designs with the TDA18219HN/C1,557 from NXP Semiconductors, a trusted leader in innovation. This compact and reliable IC is perfect for various applications, delivering superior performance in consumer electronics while ensuring seamless integration into your projects. With its robust construction and energy-efficient operation, you’ll enjoy enhanced functionality and longevity, making it an invaluable asset that elevates your product’s quality and user experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material offers excellent durability and thermal stability, making the product suitable for a wide range of consumer applications.

Surface Mount: YES

Being a surface mount device allows for space-saving on printed circuit boards (PCBs), enabling more compact designs and easier integration into modern electronics.

Package Shape: SQUARE

The square shape provides uniform dimensions and consistent performance, allowing for efficient layout and assembly in various applications.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with most modern digital circuits, facilitating easier integration into consumer products.

No. of Terminals: 40

With 40 terminals, this product supports a high level of connectivity and functionality, making it suitable for complex consumer applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers an efficient mounting solution while ensuring good thermal performance and electrical characteristics.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C allows the product to perform reliably in colder environments, increasing its versatility across applications.

Terminal Position: QUAD

The quad terminal position facilitates easy layout design and soldering, ensuring a reliable connection and improving production efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C enables compatibility with standard soldering processes, ensuring robust assembly in manufacturing.

Terminal Form: NO LEAD

The no-lead design minimizes footprint and enhances the product's electrical performance, making it ideal for high-density applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a compact design, making the product suitable for high-density circuit board layouts.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product is designed for standard handling practices, reducing the risk of damage during assembly and ensuring reliable performance.

Technical Specifications

Other Function Consumer ICs TDA18219HN/C1,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18219HN/C1,557 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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