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PCF8582C-2T/03

NXP Semiconductors

PCF8582C-2T/03 by NXP Semiconductors

The NXP Semiconductors PCF8582C-2T/03 is an EEPROM with 256x8 organization, operating at 2.7V nominal voltage. It features I2C control byte 1010DDDR and offers a memory density of 2048 bits. Ideal for industrial applications requiring reliable non-volatile memory storage with up to 1000000 write/erase cycles.

Median Price

$0.937

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Nova Conductors

Japan . 69 parts In-Stock

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$0.937

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Anansix

USA . 2,257 parts In-Stock

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Martec Srl

Italy . 1,700 parts In-Stock

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Cyclops Electronics Ltd

UK . 272 parts In-Stock

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Digiode

USA . 187 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 71 parts In-Stock

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ComSIT USA

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J2 Sourcing AB

Sweden . 31 parts In-Stock

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Holdelec - ElecDif-Pro

France . 26 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,241 parts In-Stock

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$0.937

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$0.918

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Argo Parts USA

USA . 2,019 parts In-Stock

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$0.937

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Corohmni

South Africa . 243 parts In-Stock

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$2.204

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Aztec Data Supply Inc.

USA . 747 parts In-Stock

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$2.680

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Modulus Dynamics

Lithuania . 2,152 parts In-Stock

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$3.394

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$3.394

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Ampacity Inc.

Singapore . 1,097 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 872 parts In-Stock

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One Stop Electronics

USA . 1,059 parts In-Stock

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$21.000

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Kepictronics

USA . 10,000 parts In-Stock

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Assy Fe

Spain . 4,090 parts In-Stock

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Perfect Parts

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S.R.D Solutions

India . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,441 parts In-Stock

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Corphita

USA . 1,348 parts In-Stock

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Schahn Electronic Components

Germany . 150 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 118 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$0.918

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$0.890

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$0.871

100

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$0.871

Overview

Elevate your electronics with the PCF8582C-2T/03 by NXP Semiconductors. Crafted with precision and expertise, this EEPROM device offers unparalleled quality and reliability. Perfect for a wide range of applications, this small outline package is a game-changer in the industry. Experience the seamless synchronous operation and efficient power supply management that this product provides. Trust NXP Semiconductors to deliver cutting-edge technology that enhances your projects and boosts performance. Unlock the potential of your devices with the PCF8582C-2T/03.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in this product offers durability and protection for the EEPROM, making it a reliable choice.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into electronic devices, making it a convenient option.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving design for the EEPROM, ideal for applications with limited space.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient data transfer and communication, enhancing the performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 2.7

The 2.7V supply voltage allows for low power consumption, making this EEPROM an energy-efficient solution.

Power Supplies (V): 3/5

The 3/5V power supplies offer flexibility in voltage requirements, catering to a wide range of electronic systems.

No. of Terminals: 8

With 8 terminals, the EEPROM allows for easy connection and interface with other components, simplifying the integration process.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a compact form factor, suitable for applications where space is limited.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in challenging environmental conditions.

Organization: 256X8

The 256X8 organization provides ample storage capacity for data, making it suitable for a variety of applications.

Technical Specifications

EEPROM PCF8582C-2T/03 attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000035 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCF8582C-2T/03 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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