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PCF8582C-2T

NXP Semiconductors

PCF8582C-2T by NXP Semiconductors

PCF8582C-2T by NXP Semiconductors is an EEPROM with 256x8 organization, operating at 3.3V, featuring I2C control byte 1010DDDR. It has a max clock frequency of 0.1 MHz and is ideal for industrial applications requiring memory density of 2048 bit and endurance of 100000 write/erase cycles.

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Anansix

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ComSIT Distribution GmbH

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Huijzer Components

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Aztec Data Supply Inc.

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Overview

Unleash the power of next-generation technology with the NXP Semiconductors PCF8582C-2T EEPROM. Designed for industrial-grade applications, this small outline package offers unparalleled reliability and performance. With up to 100,000 write/erase cycles and a low standby current, this EEPROM is perfect for a wide range of industries. Trust NXP Semiconductors to deliver innovative solutions that exceed expectations. Elevate your projects with the PCF8582C-2T and experience cutting-edge performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this EEPROM durable and resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and reliable data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V suits many modern electronics and reduces power consumption.

Power Supplies (V): 3/5

The dual power supplies offer flexibility in different operating conditions.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity for the device to function effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs and allows for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this EEPROM suitable for industrial applications.

Organization: 256X8

The 256x8 organization offers a good balance of storage capacity and data access speed.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics enable compatibility with a variety of systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance.

I2C Control Byte: 1010DDDR

The I2C control byte simplifies communication and control of the EEPROM.

Terminal Position: DUAL

The dual terminal position offers versatility in mounting options and PCB layout.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for slim and compact designs.

Maximum Clock Frequency (fCLK): 0.1 MHz

The maximum clock frequency of 0.1 MHz ensures fast data transfer speeds.

Width: 3.9 mm

The compact width of 3.9mm makes it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage allows for operation in low power scenarios.

Length: 4.9 mm

The length of 4.9mm provides a balance between compactness and ease of handling.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in challenging environments.

Technology: CMOS

The CMOS technology enables low power consumption and high-speed operation.

Parallel or Serial: SERIAL

The serial communication interface simplifies integration and reduces complexity in designs.

Terminal Form: GULL WING

The gull wing terminal form makes it easy to solder and mount on PCBs.

Maximum Supply Current: 2 mA

The maximum supply current of 2mA ensures efficient power usage.

No. of Words: 256 words

The 256-word capacity provides ample storage for data.

Memory Width: 8

The 8-bit memory width allows for the storage and retrieval of data in 8-bit chunks.

Minimum Data Retention Time: 10

The minimum data retention time of 10 years ensures long-term data integrity.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch offers compatibility with standard PCB layouts.

No. of Words Code: 256

The code for the 256-word capacity simplifies identification and integration.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V allows for flexibility in different power scenarios.

Endurance: 100000 Write/Erase Cycles

The high endurance of 100,000 write/erase cycles ensures long-lasting performance.

Serial Bus Type: I2C

The I2C serial bus type offers a standardized interface for communication.

Maximum Write Cycle Time (tWC): 10 ms

The maximum write cycle time of 10ms allows for fast data programming.

Memory Density: 2048 bit

The high memory density of 2048 bits provides ample storage capacity.

Memory IC Type: EEPROM

The EEPROM memory IC type offers non-volatile storage for critical data.

Maximum Standby Current: 0.000035 Amp

The low maximum standby current ensures minimal power consumption in idle mode.

Technical Specifications

EEPROM PCF8582C-2T attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Additional Features:

DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000035 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCF8582C-2T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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