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PCF8582C2D

NXP Semiconductors

PCF8582C2D by NXP Semiconductors

PCF8582C2D by NXP Semiconductors is a 256x8 EEPROM with a synchronous operating mode and I2C serial bus type. It has a max clock frequency of 0.1 MHz and can withstand temperatures up to 85°C. This IC is commonly used in industrial applications for data storage and retrieval.

Median Price

$1.600

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AZTECH Wire

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Overview

Looking for a reliable and versatile EEPROM? Look no further than the PCF8582C2D by NXP Semiconductors. With its top-notch quality and advanced technology, NXP Semiconductors ensures that this chip will exceed your expectations. This small but powerful device is perfect for a wide range of applications, offering seamless synchronization and a nominal supply voltage of 3.3V. Its compact design and industrial-grade temperature range make it suitable for various environments. Experience the value and benefits this product brings to your projects with its exceptional endurance of 1,000,000 write/erase cycles and I2C serial bus type. Trust in NXP Semiconductors and unlock the possibilities with the PCF8582C2D.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection to the EEPROM, making it suitable for various environments and applications.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort in the manufacturing process.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for efficient use of space and easy placement within electronic systems.

Operating Mode:

SYNCHRONOUS - The synchronous operation ensures accurate and reliable data transmission, enhancing the performance and functionality of the EEPROM.

Nominal Supply Voltage / Vsup (V):

3.3 - The 3.3V supply voltage makes this EEPROM compatible with a wide range of electronic devices, providing flexibility in application.

Power Supplies (V):

3/5 - This EEPROM can be powered by either 3V or 5V, offering compatibility with different power sources and system requirements.

No. of Terminals:

8 - The 8 terminals provide connectivity options and enable seamless integration of the EEPROM into the system.

Package Style (Meter):

SMALL OUTLINE - The small outline package style ensures compactness and space efficiency, making it suitable for applications with limited board space.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature allows the EEPROM to operate reliably and withstand harsh environmental conditions.

Organization:

256X8 - The organization of 256 words by 8 bits provides a sufficient amount of storage space for data, meeting the requirements of most applications.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows the EEPROM to function properly even in extremely cold conditions.

I2C Control Byte:

1010DDDR - The unique I2C control byte allows for efficient communication and control of the EEPROM within the I2C bus system.

Terminal Position:

DUAL - The dual terminal position provides flexibility in circuit design and connections, enabling the EEPROM to be used in various configurations.

Maximum Seated Height:

1.75 mm - The low seated height of the EEPROM facilitates its installation in space-constrained applications or devices.

Maximum Clock Frequency (fCLK):

0.1 MHz - The maximum clock frequency of 0.1 MHz ensures fast and efficient data transfer, enhancing the performance of the EEPROM.

Width:

3.9 mm - The compact width of the EEPROM contributes to its space-saving design and allows for easy integration into electronic systems.

Minimum Supply Voltage (Vsup):

2.5 V - The low minimum supply voltage requirement makes this EEPROM suitable for low-power and portable devices.

Maximum Time At Peak Reflow Temperature (s):

40 - The maximum time at peak reflow temperature ensures the EEPROM's reliability during the manufacturing process.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability allows the EEPROM to withstand the soldering process without damage.

Length:

4.9 mm - The compact length of the EEPROM enhances its compatibility with miniaturized electronic devices and helps optimize space on circuit boards.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade rating indicates the EEPROM's ability to withstand extended temperature ranges, making it suitable for industrial applications.

Technology:

CMOS - The CMOS technology used in this EEPROM provides low power consumption, fast operation, and reliable performance.

Parallel or Serial:

SERIAL - The serial communication interface offers simplicity, faster data transfer, and compatibility with various microcontrollers and systems.

Terminal Form:

GULL WING - The gull wing terminal form provides reliable electrical connections and facilitates automated soldering processes, ensuring consistent performance.

No. of Words:

256 words - The 256-word capacity allows for efficient storage and retrieval of data, meeting the needs of many applications.

Memory Width:

8 - The 8-bit memory width ensures compatibility with standard data formats and simplifies data handling processes.

Minimum Data Retention Time:

10 - The minimum data retention time of 10 years ensures reliable storage and preservation of data without the need for frequent updates.

Terminal Pitch:

1.27 mm - The narrow terminal pitch enables precise and compact placement of the EEPROM, offering versatility in board designs.

No. of Words Code:

256 - The availability of 256 unique code words provides a broad range of options for customization and identification purposes.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage tolerance allows for compatibility with systems that operate at higher voltage levels.

Endurance:

1000000 Write/Erase Cycles - The EEPROM's endurance of 1,000,000 write/erase cycles ensures long-lasting performance and reliability.

Serial Bus Type:

I2C - The I2C serial bus type offers simplicity, versatility, and compatibility with a wide range of devices and systems.

Maximum Write Cycle Time (tWC):

10 ms - The fast maximum write cycle time enhances the efficiency and responsiveness of the EEPROM in data storage and retrieval operations.

Memory Density:

2048 bit - The 2048-bit memory density provides ample storage capacity for various data types and applications.

Memory IC Type:

EEPROM - The EEPROM technology ensures non-volatile data storage, quick access times, and reliable performance, making it a suitable choice for many applications.

Technical Specifications

EEPROM PCF8582C2D attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Sub-Category:

EEPROMs

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCF8582C2D Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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