Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF8582C2D by NXP Semiconductors is a 256x8 EEPROM with a synchronous operating mode and I2C serial bus type. It has a max clock frequency of 0.1 MHz and can withstand temperatures up to 85°C. This IC is commonly used in industrial applications for data storage and retrieval.
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ChipTracer
PLASTIC/EPOXY - This material provides durability and protection to the EEPROM, making it suitable for various environments and applications.
YES - The surface mount feature allows for easy installation and integration onto circuit boards, saving time and effort in the manufacturing process.
RECTANGULAR - The rectangular shape of the package allows for efficient use of space and easy placement within electronic systems.
SYNCHRONOUS - The synchronous operation ensures accurate and reliable data transmission, enhancing the performance and functionality of the EEPROM.
3.3 - The 3.3V supply voltage makes this EEPROM compatible with a wide range of electronic devices, providing flexibility in application.
3/5 - This EEPROM can be powered by either 3V or 5V, offering compatibility with different power sources and system requirements.
8 - The 8 terminals provide connectivity options and enable seamless integration of the EEPROM into the system.
SMALL OUTLINE - The small outline package style ensures compactness and space efficiency, making it suitable for applications with limited board space.
85 °C - The high maximum operating temperature allows the EEPROM to operate reliably and withstand harsh environmental conditions.
256X8 - The organization of 256 words by 8 bits provides a sufficient amount of storage space for data, meeting the requirements of most applications.
40 °C - The low minimum operating temperature allows the EEPROM to function properly even in extremely cold conditions.
1010DDDR - The unique I2C control byte allows for efficient communication and control of the EEPROM within the I2C bus system.
DUAL - The dual terminal position provides flexibility in circuit design and connections, enabling the EEPROM to be used in various configurations.
1.75 mm - The low seated height of the EEPROM facilitates its installation in space-constrained applications or devices.
0.1 MHz - The maximum clock frequency of 0.1 MHz ensures fast and efficient data transfer, enhancing the performance of the EEPROM.
3.9 mm - The compact width of the EEPROM contributes to its space-saving design and allows for easy integration into electronic systems.
2.5 V - The low minimum supply voltage requirement makes this EEPROM suitable for low-power and portable devices.
40 - The maximum time at peak reflow temperature ensures the EEPROM's reliability during the manufacturing process.
260 - The high peak reflow temperature capability allows the EEPROM to withstand the soldering process without damage.
4.9 mm - The compact length of the EEPROM enhances its compatibility with miniaturized electronic devices and helps optimize space on circuit boards.
INDUSTRIAL - The industrial temperature grade rating indicates the EEPROM's ability to withstand extended temperature ranges, making it suitable for industrial applications.
CMOS - The CMOS technology used in this EEPROM provides low power consumption, fast operation, and reliable performance.
SERIAL - The serial communication interface offers simplicity, faster data transfer, and compatibility with various microcontrollers and systems.
GULL WING - The gull wing terminal form provides reliable electrical connections and facilitates automated soldering processes, ensuring consistent performance.
256 words - The 256-word capacity allows for efficient storage and retrieval of data, meeting the needs of many applications.
8 - The 8-bit memory width ensures compatibility with standard data formats and simplifies data handling processes.
10 - The minimum data retention time of 10 years ensures reliable storage and preservation of data without the need for frequent updates.
1.27 mm - The narrow terminal pitch enables precise and compact placement of the EEPROM, offering versatility in board designs.
256 - The availability of 256 unique code words provides a broad range of options for customization and identification purposes.
6 V - The high maximum supply voltage tolerance allows for compatibility with systems that operate at higher voltage levels.
1000000 Write/Erase Cycles - The EEPROM's endurance of 1,000,000 write/erase cycles ensures long-lasting performance and reliability.
I2C - The I2C serial bus type offers simplicity, versatility, and compatibility with a wide range of devices and systems.
10 ms - The fast maximum write cycle time enhances the efficiency and responsiveness of the EEPROM in data storage and retrieval operations.
2048 bit - The 2048-bit memory density provides ample storage capacity for various data types and applications.
EEPROM - The EEPROM technology ensures non-volatile data storage, quick access times, and reliable performance, making it a suitable choice for many applications.
EEPROM PCF8582C2D attributes and parameters. Explore more EEPROM devices from NXP Semiconductors
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
I2C Control Byte:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Serial Bus Type:
Sub-Category:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Maximum Write Cycle Time (tWC):
PCF8582C2D Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
Daco Semiconductor
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Sensitron Semiconductor
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
Gec Plessey Semiconductors
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
1N4148
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24256-BRMN6P
STMicroelectronics
STMicroelectronics M24256-BRMN6P is an EEPROM with 32KX8 organization, operating at 2.5V, and featuring I2C serial bus type. It has a memory density of 262144 bit, endurance of 1M cycles, and operates in industrial temperature range. Ideal for applications requiring reliable non-volatile memory storage in compact designs.
XCF01SVO20C0936
Xilinx
Xilinx XCF01SVO20C0936 is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and uses CMOS technology. Ideal for industrial applications, this SERIAL memory IC features a 0.65mm terminal pitch in a SMALL OUTLINE package style.
DS24B33S+
Maxim Integrated
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
24AA256UID-I/ST
Microchip Technology
24AA256UID-I/ST by Microchip Technology is a serial EEPROM with a memory density of 262144 bits. It operates in synchronous mode and has a max clock frequency of 0.4 MHz. This EEPROM is commonly used in industrial applications that require reliable data storage and retrieval.
24LC256-I/STG
24LC256-I/STG by Microchip Technology is an EEPROM with 32KX8 organization, operating at 3/5V. It features I2C control byte 1010DDDR and offers 1000000 write/erase cycles. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact package.
M24C02-FMN6TP
STMicroelectronics' M24C02-FMN6TP is an EEPROM with 256x8 organization, operating at 1.8/5V. It features I2C control byte 1010DDDR and offers 4000000 write/erase cycles. Ideal for applications requiring low power consumption and reliable data storage in a compact small outline package.
X28HC256JI-12
Intersil
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Write Cycle Time (tWC): 5 ms;
AT24C512C-SSHD-B
AT24C512C-SSHD-B by Microchip: 64KX8 EEPROM, 1MHz fCLK, I2C control byte. Ideal for industrial applications requiring 524288 bit memory density and 1000000 Write/Erase cycles. Operating temp -40 to 85 °C with small outline package style.
AT24C32D-SSHM-T
Atmel
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
DS2433S
DS2433S by Maxim Integrated is a 1-WIRE EEPROM with 4096-bit memory density. It operates at 5V, has 50000 write/erase cycles endurance, and supports asynchronous mode. Ideal for industrial applications requiring small outline package with serial interface.
AT24CM01-XHM-B
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
XCF01SVOG20CES
Xilinx XCF01SVOG20CES is a 1MX1 EEPROM with 1048576 bit memory density. Operating at 3.3V, it offers industrial-grade temperature range of -40 to 85 °C. Ideal for configuration memory applications, this serial CMOS technology device has a small outline package with dual terminal position and matte tin finish.
XCF02SVOG20C
Xilinx XCF02SVOG20C is a 2MX1 NOR EEPROM with 2097152-bit memory density. Operating at 3.3V, it offers 20000 write/erase cycles and supports industrial temperature grade applications. With a small outline package style, 0.65mm terminal pitch, and Gull Wing terminals, it's ideal for configuration memory needs in various electronic devices.
AT24C512C-XHM-T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Memory Width: 8;
DS2433S/T&R
DS2433S/T&R by Maxim Integrated is a 1-WIRE EEPROM with 4Kx1 organization, operating at 5V. It offers 50,000 write/erase cycles and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring reliable non-volatile memory storage in compact designs.
DS28E22P+T
Analog Devices
DS28E22P+T by Analog Devices is a 2048-bit EEPROM with 1-WIRE serial bus, operating at -40 to 85°C. It has a supply voltage range of 2.97V to 3.63V and comes in a small outline package suitable for industrial applications. With asynchronous operation and CMOS technology, it offers reliable non-volatile memory storage in a compact form factor.
24LC64T-I/MS
24LC64T-I/MS by Microchip Technology is an EEPROM with 8KX8 organization, 65536 bit memory density, and 1000000 Write/Erase Cycles endurance. It operates in SERIAL mode at a max clock frequency of 0.4 MHz. Ideal for industrial applications requiring reliable non-volatile memory storage.
AT28HC256-12FM/883
AT28HC256-12FM/883 by Microchip is a MILITARY-grade EEPROM with 32KX8 organization, 3-STATE output, and 262144 bit memory density. It operates at -55 to 125 °C with 10 ms write cycle time. Ideal for applications requiring high endurance and fast access times in harsh environments.
CAT24C64YI-GT3
Catalyst Semiconductor
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
AT24C256N-10SU-2.7
AT24C256N-10SU-2.7 by Microchip: 32KX8 organization, 1 MHz clock frequency, 262144 bit memory density. Ideal for industrial applications requiring EEPROM with I2C serial bus and 1000000 write/erase cycles endurance.
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PCF85103C-2T/00,11
NXP Semiconductors
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 6 V;
PCF8582C-2T/03
The NXP Semiconductors PCF8582C-2T/03 is an EEPROM with 256x8 organization, operating at 2.7V nominal voltage. It features I2C control byte 1010DDDR and offers a memory density of 2048 bits. Ideal for industrial applications requiring reliable non-volatile memory storage with up to 1000000 write/erase cycles.
Philips Semiconductors
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
PCF8582C-2T/03,118
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
PCF8594C-2T/02,112
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Write Protection: HARDWARE;
PCF8582C-2P
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 2 mA;
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): .1 MHz;
PCF8582C-2P/03,112
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.5 mm;
PCF8582C-2T/03,112
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1;
PCF8582C2D-T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): .1 MHz;
PCF8582C-2T
PCF8582C-2T by NXP Semiconductors is an EEPROM with 256x8 organization, operating at 3.3V, featuring I2C control byte 1010DDDR. It has a max clock frequency of 0.1 MHz and is ideal for industrial applications requiring memory density of 2048 bit and endurance of 100000 write/erase cycles.
PCF85103C-2T
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
PCF85102C-2T/03
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
PCF85103C-2T/00
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 256X8;
PCF85102C-2P
PCF85102C-2T/03,11
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
PCF85103C-2T/00,118
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.5 V;
PCF85103C-2T/G,118
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8;
PCF8582CT
EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 2.5 mA;
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