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PCF8582C-2P

NXP Semiconductors

PCF8582C-2P by NXP Semiconductors

PCF8582C-2P by NXP Semiconductors is an EEPROM with 256x8 organization, I2C control byte 1010DDDR, and 2048-bit memory density. It operates in synchronous mode at a max clock frequency of 0.1 MHz and is ideal for industrial applications requiring reliable non-volatile memory storage.

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Digiode

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Nova Conductors

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Cogito LLC

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Resion

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ECAB

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GES GmbH

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South Africa . 395 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

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Ampacity Inc.

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Overview

Unlock endless possibilities with the NXP Semiconductors PCF8582C-2P EEPROM. Crafted with precision and quality in mind, this cutting-edge technology offers unparalleled performance and reliability. Ideal for a wide range of applications, this innovative product guarantees seamless integration and optimal functionality. Experience the value and benefits of the PCF8582C-2P, where quality meets innovation to exceed customer expectations. Elevate your projects with the superior capabilities of this must-have component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the EEPROM, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control, making the EEPROM efficient and reliable in data storage.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a lower supply voltage of 3.3V can help in reducing power consumption and heat generation.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other devices or systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this EEPROM can withstand harsh environmental conditions without malfunctioning.

Organization: 256X8

The 256X8 organization allows for efficient data storage and retrieval, catering to a wide range of applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristic enables easy interfacing with other components and devices in a system.

I2C Control Byte: 1010DDDR

The I2C control byte provides a standardized communication protocol, ensuring compatibility with various systems and devices.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating, this EEPROM can handle frequent write and erase cycles without degradation in performance.

Serial Bus Type: I2C

Utilizing the I2C serial bus type allows for easy integration and communication with other I2C compatible devices in a system.

Technical Specifications

EEPROM PCF8582C-2P attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Additional Features:

DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

Endurance:

100000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000035 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCF8582C-2P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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