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PCF8582C-2P/03,112

NXP Semiconductors

PCF8582C-2P/03,112 by NXP Semiconductors

NXP Semiconductors' PCF8582C-2P/03,112 is an 8-terminal EEPROM with a 256x8 organization and operates synchronously at up to 0.1 MHz. It uses I2C serial bus for control and has a memory density of 2048 bits. Ideal for industrial applications requiring reliable non-volatile memory storage.

Median Price

$0.933

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 74 parts In-Stock

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$0.933

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Digiode

USA . 4,152 parts In-Stock

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Vyrian

USA . 2,372 parts In-Stock

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Anansix

USA . 414 parts In-Stock

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Argo Parts USA

USA . 2,629 parts In-Stock

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$0.933

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Continental Prestige Electronics

USA . 2,556 parts In-Stock

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$0.933

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$0.914

2,556

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Modulus Dynamics

Lithuania . 3,583 parts In-Stock

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$2.064

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$2.064

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$2.064

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Aztec Data Supply Inc.

USA . 3,478 parts In-Stock

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$4.090

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Corohmni

South Africa . 439 parts In-Stock

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$4.181

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Microchip USA

USA . 492 parts In-Stock

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$5.070

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AZTECH Wire

Italy . 707 parts In-Stock

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$12.931

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Ampacity Inc.

Singapore . 683 parts In-Stock

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$19.000

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One Stop Electronics

USA . 974 parts In-Stock

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UNI Independent Distributors

Spain . 4,718 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.914

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$0.886

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$0.868

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Corphita

USA . 1,861 parts In-Stock

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Perfect Parts

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Overview

Experience the superior quality and reliability of NXP Semiconductors with the PCF8582C-2P/03,112 EEPROM. This versatile memory component offers endless applications in industrial settings, ensuring optimal performance and durability. With a wide operating temperature range and high endurance, this product guarantees long-lasting functionality, making it the perfect choice for your electronic projects. Trust NXP Semiconductors to deliver top-notch components that exceed expectations and bring value to your designs. Choose the PCF8582C-2P/03,112 for unparalleled performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the EEPROM chip, making it suitable for a variety of environments.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and communication with other devices, enhancing overall system performance.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V supply voltage is a common standard in many electronic systems, making integration and compatibility easier.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM chip offers sufficient storage capacity for storing critical data and information.

Endurance: 1000000 Write/Erase Cycles

The high endurance rating ensures long-term reliability and longevity of the EEPROM chip, making it ideal for frequent read/write operations.

Serial Bus Type: I2C

The I2C serial bus type allows for easy interfacing with other components on the same bus, simplifying communication and control within the system.

Technical Specifications

EEPROM PCF8582C-2P/03,112 attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000035 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCF8582C-2P/03,112 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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