Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2119RU/2DB/2Z by NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V, supports 80 segments, and functions in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it features an 18-backplane configuration.
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The segment display mode allows for clear and precise visual output, making it ideal for applications that require easy readability.
The versatile power supply range ensures compatibility with various systems, providing flexibility in design and integration.
With 18 backplanes, this IC can handle multiple segments, allowing for complex display configurations and enhanced functionality.
The ability to operate at high temperatures ensures reliability and performance in demanding environments, making it suitable for industrial applications.
This product's functionality at extremely low temperatures allows it to be utilized in harsh climates, broadening its application range.
Designed for industrial use, this IC offers durability and longevity in rugged conditions, making it an excellent choice for long-term deployments.
The use of CMOS technology enhances power efficiency, reducing energy consumption while maintaining high performance levels, beneficial for battery-operated devices.
With the capability to display up to 80 segments, this IC can represent detailed information and complex data, making it versatile for a wide range of applications.
Other Function Interface ICs PCF2119RU/2DB/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Display Mode:
No. of Backplanes:
No. of Segments:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Power Supplies (V):
Qualification:
Sub-Category:
Technology:
Temperature Grade:
PCF2119RU/2DB/2Z Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Intersil
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
Continental Device India
Secos
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
TXB0101DCKR
TXB0101DCKR by Texas Instruments is a 6-terminal IC with 3-STATE output, operating b/w -40 to 85 °C. It has a supply voltage range of 1.2-5.5 V and terminal finish of Ni/Pd/Au, suitable for industrial interface circuit applications in compact designs.
TXB0104RGYR
TXB0104RGYR by Texas Instruments is a 4-bit interface IC with 3-STATE output, operating at -40 to 85 °C. It has a max supply voltage of 5.5 V and terminal pitch of 0.5 mm. Ideal for industrial applications requiring true output polarity and low power consumption.
LTC6820HMS#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
ADUM1251ARZ-RL7
Analog Devices
ADUM1251ARZ-RL7 by Analog Devices is an 8-terminal IC with a supply voltage range of 3V to 5.5V, operating temperature from -40°C to 105°C, and CMOS technology. It is used as an interface circuit in industrial applications due to its small outline package style and dual terminal position for surface mount assembly.
ADUM2400ARWZ-RL
ADUM2400ARWZ-RL by Analog Devices is a 16-terminal interface IC with supply voltage range of 2.7V to 5.5V, operating temperature from -40°C to 105°C. It features CMOS technology and GULL WING terminal form, suitable for industrial applications requiring small outline package style and surface mount compatibility.
LTC6820HMS#PBF
LTC6820HMS#PBF by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and is suitable for automotive applications due to its small outline package style and matte tin terminal finish.
SI8602AC-B-ISR
Skyworks Solutions
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
MAX14850ASE+
MAX14850ASE+ by Analog Devices is a BICMOS interface IC with 16 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 3-5.5 V and is designed for automotive applications requiring small outline packages and surface mount technology.
EL6203CWZ-T7
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
SI8660BB-B-IS1
Silicon Labs
SI8660BB-B-IS1 by Silicon Labs is a digital isolator with 16 terminals and a small outline package style. It operates at a min voltage of 2.375 V and has a max supply voltage of 5.5 V. This IC is commonly used for other function interface applications in various industries.
TCA9517ADGKR
TCA9517ADGKR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small outline package style, dual terminal position, and BICMOS technology. With a temperature range of -40°C to 85°C, it is ideal for various function interface requirements in electronic devices.
ISO7140FCCDBQR
ISO7140FCCDBQR by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 2.7-5 V and is ideal for automotive applications due to its small size, surface mount capability, and interface circuit functionality.
TXS0102DQER
TXS0102DQER by Texas Instruments is a 2-bit interface IC with 3-STATE output. It operates b/w -40 to 85°C, with supply voltage ranging from 1.65V to 5.5V. Ideal for industrial applications requiring small outline and thin profile packages in surface-mount configurations.
TCA9406DCTR
TCA9406DCTR by Texas Instruments is an interface IC with 1 function, operating voltage range of 1.65V to 5.5V, and industrial temperature grade. It comes in a small outline package with dual terminals and nickel palladium gold finish. Ideal for applications requiring low profile design and surface mount capability.
ADUM6401CRIZ-RL
ADUM6401CRIZ-RL by Analog Devices is a digital isolator with 16 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3-5.5V and comes in a small outline package suitable for industrial applications requiring high temperature tolerance and electrical isolation.
SI8662BB-B-IU
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
ISO1541DR
ISO1541DR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 3V to 5.5V. It operates in temperatures from -40°C to 125°C, making it suitable for automotive applications. The package style is small outline, with dual terminal position and Gull Wing form, ideal for surface mount assembly.
LTC6820IMS#PBF
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
ISO7841FDWW
ISO7841FDWW by Texas Instruments is a digital isolator with 4 channels, operating at -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The IC features CMOS technology, GULL WING terminals, and is surface-mountable for compact designs.
SI8663BD-B-ISR
SI8663BD-B-ISR by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It has a small outline package style, CMOS technology, and can operate in temperatures ranging from -40°C to 125°C.
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PCF2112CT
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2113DH/4
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2119AU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119DU/2/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 1.5/5.5,2.2/6.5; No. of Segments: 80; No. of Backplanes: 18-BP; Maximum Operating Temperature: 85 Cel;
PCF2119FU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2114AU
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 60; Package Equivalence Code: DIE OR CHIP; Technology: CMOS; No. of Backplanes: 32-BP;
PCF2116GU/10
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Segments: 60; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 3/5;
PCF2116GU/12
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 32-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Technology: CMOS;
PCF2116AHZ
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2119RU/2
Other Interface ICs; Temperature Grade: OTHER; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2119SU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Segments: 80; Maximum Operating Temperature: 85 Cel;
PCF2119VU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119AU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Segments: 80; Power Supplies (V): 1.5/5.5,2.2/6.5; Package Equivalence Code: DIE OR CHIP;
PCF2119DU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5;
PCF2119FU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Backplanes: 18-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel;
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