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PCF2119RU/2DB/2Z

NXP Semiconductors

PCF2119RU/2DB/2Z by NXP Semiconductors

PCF2119RU/2DB/2Z by NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V, supports 80 segments, and functions in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it features an 18-backplane configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,317 parts In-Stock

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Digiode

USA . 2,761 parts In-Stock

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Anansix

USA . 1,452 parts In-Stock

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Microchip USA

USA . 473 parts In-Stock

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$1.747

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AZTECH Wire

Italy . 572 parts In-Stock

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One Stop Electronics

USA . 760 parts In-Stock

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$25.500

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Corphita

USA . 3,204 parts In-Stock

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UNI Independent Distributors

Spain . 2,735 parts In-Stock

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Vigor

Singapore . 706 parts In-Stock

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Overview

Unlock exceptional display quality with the PCF2119RU/2DB/2Z from NXP Semiconductors. Renowned for its innovation and reliability, NXP delivers a versatile interface IC perfect for various applications, from industrial to consumer electronics. With robust temperature resilience and power efficiency, this product ensures peak performance in demanding environments, enhancing user experience while reducing energy costs—an unbeatable advantage for your designs!

Feature Benefit Bullets

Display Mode: SEGMENT

The segment display mode allows for clear and precise visual output, making it ideal for applications that require easy readability.

Power Supplies: 1.5/5.5, 2.2/6.5

The versatile power supply range ensures compatibility with various systems, providing flexibility in design and integration.

No. of Backplanes: 18-BP

With 18 backplanes, this IC can handle multiple segments, allowing for complex display configurations and enhanced functionality.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability and performance in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

This product's functionality at extremely low temperatures allows it to be utilized in harsh climates, broadening its application range.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this IC offers durability and longevity in rugged conditions, making it an excellent choice for long-term deployments.

Technology: CMOS

The use of CMOS technology enhances power efficiency, reducing energy consumption while maintaining high performance levels, beneficial for battery-operated devices.

No. of Segments: 80

With the capability to display up to 80 segments, this IC can represent detailed information and complex data, making it versatile for a wide range of applications.

Technical Specifications

Other Function Interface ICs PCF2119RU/2DB/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

18-BP

No. of Segments:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.5/5.5,2.2/6.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF2119RU/2DB/2Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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