Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2119RU/2DB/2Z by NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V, supports 80 segments, and functions in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it features an 18-backplane configuration.
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The segment display mode allows for clear and precise visual output, making it ideal for applications that require easy readability.
The versatile power supply range ensures compatibility with various systems, providing flexibility in design and integration.
With 18 backplanes, this IC can handle multiple segments, allowing for complex display configurations and enhanced functionality.
The ability to operate at high temperatures ensures reliability and performance in demanding environments, making it suitable for industrial applications.
This product's functionality at extremely low temperatures allows it to be utilized in harsh climates, broadening its application range.
Designed for industrial use, this IC offers durability and longevity in rugged conditions, making it an excellent choice for long-term deployments.
The use of CMOS technology enhances power efficiency, reducing energy consumption while maintaining high performance levels, beneficial for battery-operated devices.
With the capability to display up to 80 segments, this IC can represent detailed information and complex data, making it versatile for a wide range of applications.
Other Function Interface ICs PCF2119RU/2DB/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Display Mode:
No. of Backplanes:
No. of Segments:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Power Supplies (V):
Qualification:
Sub-Category:
Technology:
Temperature Grade:
PCF2119RU/2DB/2Z Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
1N4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS3303C
Idec
ROTARY SWITCH;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
1N4148WS
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TFDU4101-TT3
TFDU4101-TT3 by Vishay Intertechnology is an 8-terminal interface IC with a max supply voltage of 5.5V and min of 2.4V, suitable for applications requiring a CMOS technology-based solution. With a compact rectangular package style measuring 9.9mm x 4.7mm x 4.2mm, it operates within a temperature range of -30°C to 85°C, making it ideal for various electronic devices and systems.
SI8640BC-B-IS1
Silicon Labs
SI8640BC-B-IS1 by Silicon Labs is a digital isolator with 4 functions, operating voltage range of 2.375-5.5V, and temp range of -40 to 125°C. It comes in a small outline package suitable for surface mount applications in various electronic devices.
TXS0104EDR
Texas Instruments
TXS0104EDR by Texas Instruments is a 4-bit interface IC with max supply voltage of 3.6V and operating temp range of -40 to 85°C. It features 3-STATE output characteristics, suitable for industrial applications requiring small outline package style and dual terminal position.
ISO7710DR
ISO7710DR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 2.25V to 5.5V, suitable for military-grade applications. It features a small outline package style, dual terminal position, and CMOS technology. With a temperature range from -55°C to 125°C, it is ideal for various function interface requirements in harsh environments.
PCA9306DCUTE4
PCA9306DCUTE4 by Texas Instruments is an interface IC with 2 functions. It operates b/w 1.2V to 5.5V, suitable for industrial applications. With a small outline and thin profile, it has a terminal pitch of 0.5mm and can withstand temperatures from -40°C to 85°C.
SN6505BDBVT
SN6505BDBVT by Texas Instruments is a small outline interface IC with 6 terminals, operating b/w -55 to 125°C. It has a max supply voltage of 5.5V and can handle up to 1.5A output current. Ideal for military-grade applications requiring low profile components in compact spaces.
SI8662BD-B-IS
Silicon Labs' SI8662BD-B-IS is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, GULL WING terminal form, and small outline package style suitable for high-temperature environments up to 125°C.
ADUM4401ARWZ
Analog Devices
ADUM4401ARWZ by Analog Devices is a 16-terminal interface IC with supply voltage range of 2.7V to 5.5V, suitable for industrial applications. It features CMOS technology, operates b/w -40°C to 105°C, and has a small outline package style ideal for surface mount assembly.
FXMA2102UMX
FXMA2102UMX by Onsemi is a surface mount interface IC with 1 function, operating voltage range of 1.65V to 5.5V, and industrial temperature grade. It features a chip carrier package style, quad terminal position, and nickel palladium finish. Ideal for applications requiring precise signal interfacing in harsh environments.
ISO7731FQDWRQ1
ISO7731FQDWRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 3 functions, operating at -40 to 125°C. It has a supply voltage range of 2.25-5.5V and features a small outline package suitable for automotive applications. The CMOS technology, GULL WING terminals, and nickel/palladium/gold finish make it ideal for various automotive interface circuit designs.
SI8641BB-B-IS
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
ISO7741QDBQQ1
ISO7741QDBQQ1 by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it ideal for automotive applications requiring AEC-Q100 screening. The small outline package with dual terminals and nickel/palladium/gold finish ensures reliability in harsh environments.
ISO7740FDBQR
ISO7740FDBQR by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. This interface circuit in small outline package is ideal for military applications requiring high reliability and dual terminal position.
MAX253CSA+T
Maxim Integrated
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ISO7762QDBQRQ1
ISO7762QDBQRQ1 by Texas Instruments is a digital isolator with 6 channels, operating at -40 to 125°C. It features a supply voltage range of 2.25-5.5V and AEC-Q100 screening for automotive applications. The package is small outline with dual gull wing terminals, suitable for surface mount assembly.
ISO7731BDW
ISO7731BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it offers 3 channels and features a small outline package style for surface mount assembly.
MAX7301ATL+
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
SI8641EC-B-IS1R
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
ISO7741BDWR
ISO7741BDWR by Texas Instruments is a digital isolator with 4 channels, operating at -55 to 125°C. It features a supply voltage range of 2.25-5.5V and interface standards EIA-232/EIA-485. Ideal for military-grade applications requiring reliable signal isolation in compact spaces.
ISO7721QDWRQ1
ISO7721QDWRQ1 by Texas Instruments is a digital isolator with 2 channels, operating at -40 to 125 °C. It has a supply voltage range of 2.25-5.5 V and is AEC-Q100 compliant for automotive applications. The IC features a small outline package with 16 terminals, suitable for surface mount assembly in various electronic systems.
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PCF2112CT
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2113DH/4
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2119AU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119DU/2/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 1.5/5.5,2.2/6.5; No. of Segments: 80; No. of Backplanes: 18-BP; Maximum Operating Temperature: 85 Cel;
PCF2119FU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2114AU
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 60; Package Equivalence Code: DIE OR CHIP; Technology: CMOS; No. of Backplanes: 32-BP;
PCF2116GU/10
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Segments: 60; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 3/5;
PCF2116GU/12
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 32-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Technology: CMOS;
PCF2116AHZ
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2119RU/2
Other Interface ICs; Temperature Grade: OTHER; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2119SU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Segments: 80; Maximum Operating Temperature: 85 Cel;
PCF2119VU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119AU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Segments: 80; Power Supplies (V): 1.5/5.5,2.2/6.5; Package Equivalence Code: DIE OR CHIP;
PCF2119DU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5;
PCF2119FU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Backplanes: 18-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel;
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