Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2119AU/2DA/2Z by NXP Semiconductors is a versatile segment display driver with 80 segments and 18 backplanes. It operates within a wide voltage range of 1.5-6.5V and withstands temperatures from -40 °C to 85 °C, making it ideal for industrial applications. This CMOS technology ensures reliable performance in various environments.
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The SEGMENT display mode allows for clear and efficient presentation of information, making the product suitable for a wide range of applications.
The flexibility in power supply voltage ranges ensures compatibility with various systems, enhancing design versatility.
With 18 backplanes, this product can drive complex display configurations, ideal for advanced user interfaces.
The ability to operate at high temperatures makes this IC reliable for use in demanding industrial environments.
Rated for extremely low temperatures, this IC ensures functionality in harsh climates, further broadening its application spectrum.
Designed to meet industrial-grade standards, this IC offers enhanced durability and reliability for long-term operation.
CMOS technology provides low power consumption and high performance, making this product efficient for prolonged usage.
With 80 segments, this IC provides the capability for detailed display outputs, allowing for complex information representation.
Other Function Interface ICs PCF2119AU/2DA/2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Display Mode:
No. of Backplanes:
No. of Segments:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Power Supplies (V):
Qualification:
Sub-Category:
Technology:
Temperature Grade:
PCF2119AU/2DA/2Z Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - PCF2119AU/SA6x obs 18/Aug/2022
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
1N4148WS
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
LL4148-GS08
Telefunken Microelectronics
RECTIFIER DIODE; Surface Mount: YES; JESD-609 Code: e0; No. of Elements: 1; Maximum Operating Temperature: 175 Cel; Maximum Non Repetitive Peak Forward Current: 2 A;
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Littelfuse
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
1N4148WT
Continental Device India
Fairchild Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
SI8660BA-B-IS1R
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 2.375 V;
ADUM1201BRZ
Analog Devices
ADUM1201BRZ by Analog Devices is a dual-function interface IC with 2 functions, operating voltage range of 2.7V to 5.5V, and industrial temperature grade. It comes in a small outline package with matte tin finish, suitable for various interface circuit applications requiring reliable performance in harsh environments.
ADUM1401BRWZ-RL
ADUM1401BRWZ-RL by Analog Devices is a 16-terminal IC with 4 functions. It operates b/w -40 to 105°C, supporting EIA-232, EIA-422, and EIA-485 interfaces. With a supply voltage range of 2.7V to 5.5V, it's ideal for industrial applications requiring reliable interface circuitry in compact spaces.
PCA9306DQER
PCA9306DQER by Texas Instruments is a dual-function interface IC with 2 bits, open-drain output, and latch register. It operates b/w -40 to 85°C, supports a supply voltage range of 0-5.5V, and has a small outline package style. Ideal for industrial applications requiring level shifting in compact designs.
SI8663BD-B-ISR
Silicon Labs
SI8663BD-B-ISR by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It has a small outline package style, CMOS technology, and can operate in temperatures ranging from -40°C to 125°C.
ISO7231CDWG4
ISO7231CDWG4 by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -40 to 125°C. It has a supply voltage range of 3.15V to 5.5V and is suitable for automotive applications due to its nickel palladium gold finish and small outline package style.
6ES7132-6BH01-0BA0
Siemens
Digital O/P Module;
LTC6820HUD#PBF
LTC6820HUD#PBF by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and is suitable for automotive applications due to its high-temperature grade. The package style is chip carrier with a very thin profile, making it ideal for space-constrained designs.
XSN6505BQDBVTQ1
XSN6505BQDBVTQ1 by Texas Instruments is a small outline interface IC with 6 terminals, operating at -40 to 125°C. It has a supply voltage range of 2.25-5.5V and AEC-Q100 screening for automotive applications. The package is rectangular, low profile, with gull wing terminals suitable for surface mount assembly.
LTC6820HMS#TRPBF
Linear Technology
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
TFBS4650-TR1
Vishay Semiconductors
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 7; Package Code: SMA; Package Shape: RECTANGULAR;
ISO7741QDWWQ1
ISO7741QDWWQ1 by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 2.25-5.5V, it comes in a small outline package with dual terminals and nickel/palladium/gold finish.
ISO7741FQDWRQ1
ISO7741FQDWRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125°C. It features a supply voltage range of 2.25-5.5V and is AEC-Q100 compliant for automotive applications. With CMOS technology, it offers a compact design in small outline package suitable for surface mount assembly.
PCA9517ADP/DG,118
NXP Semiconductors
PCA9517ADP/DG,118 by NXP Semiconductors is an 8-terminal IC with a max supply voltage of 5.5V and min operating temp of -40°C. Ideal for industrial applications, it features a small outline package style and CMOS technology for interface circuits.
SI8641AB-B-IS1R
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm;
TXB0108YZPR2
TXB0108YZPR2 by Texas Instruments is an 8-bit interface IC with a supply voltage range of 1.2V to 3.6V and operating temperature from -40°C to 85°C. It features a 3-STATE output characteristic, very thin profile grid array package style, and bottom terminal position. Ideal for industrial applications requiring low supply current and precise signal interfacing in compact designs.
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
PI4IOE5V6416ZDEX
Diodes Incorporated
PI4IOE5V6416ZDEX by Diodes Incorporated is a 24-terminal interface IC with a supply voltage range of 1.65V to 5.5V and operating temperature from -40°C to 85°C. This chip carrier package has a square shape, 0.9mm seated height, and 0.5mm terminal pitch, making it suitable for various other function interface applications.
ISO7731FDWR
ISO7731FDWR by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -55 to 125°C. It features CMOS technology, GULL WING terminals, and MILITARY grade temperature tolerance. Ideal for INTERFACE CIRCUITS in applications requiring small outline packages and surface mount compatibility.
EL6203CW-T7A
Intersil
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
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PCF2112CT
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2113DH/4
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2119DU/2/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 1.5/5.5,2.2/6.5; No. of Segments: 80; No. of Backplanes: 18-BP; Maximum Operating Temperature: 85 Cel;
PCF2119FU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2DB/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 80; No. of Backplanes: 18-BP; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2116AU
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Power Supplies (V): 3/5; Minimum Operating Temperature: -40 Cel; No. of Segments: 60;
PCF2116JU
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 3/5; No. of Segments: 60; Technology: CMOS;
PCF2114GH
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2116AH
PCF2119RU/2
Other Interface ICs; Temperature Grade: OTHER; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2119SU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Segments: 80; Maximum Operating Temperature: 85 Cel;
PCF2119VU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119AU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Segments: 80; Power Supplies (V): 1.5/5.5,2.2/6.5; Package Equivalence Code: DIE OR CHIP;
PCF2119DU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5;
PCF2119FU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Backplanes: 18-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel;
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