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PCF2112CT

Philips Semiconductors

PCF2112CT by Philips Semiconductors

Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;

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Technical Specifications

Other Function Interface ICs PCF2112CT attributes and parameters. Explore more Other Function Interface ICs devices from Philips Semiconductors

Specs

Display Mode:

SEGMENT

JESD-30 Code:

R-PDSO-G40

JESD-609 Code:

e0

No. of Backplanes:

2-BP

No. of Segments:

32

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP40,.5,30

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.25/6

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.05 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn85Pb15)

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

DUAL

Trade Compliance

PCF2112CT Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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