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PCF2119RU/2/F2Z

NXP Semiconductors

PCF2119RU/2/F2Z by NXP Semiconductors

PCF2119RU/2/F2Z from NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V and supports up to 80 segments across 18 backplanes, functioning in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it ensures reliable performance in demanding environments.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,086 parts In-Stock

1+ parts

-

100+ parts

$2.070

1k+ parts

$1.850

10k+ parts

$1.740

9,086

-

$2.070

$1.850

$1.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,178 parts In-Stock

1+ parts

$3.506

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2,178

$3.506

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Flip Electronics

USA . 9,086 parts In-Stock

1+ parts

-

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9,086

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Vyrian

USA . 2,734 parts In-Stock

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2,734

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Anansix

USA . 2,166 parts In-Stock

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2,166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 717 parts In-Stock

1+ parts

$2.048

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717

$2.048

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Corphita

USA . 1,822 parts In-Stock

1+ parts

$3.321

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1,822

$3.321

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Microchip USA

USA . 11,160 parts In-Stock

1+ parts

$11.921

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11,160

$11.921

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

1+ parts

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9,000

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UNI Independent Distributors

Spain . 3,270 parts In-Stock

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3,270

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Overview

Unlock the potential of your designs with the PCF2119RU/2/F2Z from NXP Semiconductors—your trusted partner in high-quality technology. This versatile interface IC enhances display capabilities across various applications, ensuring reliability even in extreme environments. Boasting superior performance and energy efficiency, it empowers your projects while minimizing costs. Choose NXP for unparalleled innovation and transform your vision into reality!

Feature Benefit Bullets

Display Mode: SEGMENT

The segment display mode allows for clear and easy-to-read visual output, making this IC suitable for a wide range of applications requiring numerical or alphanumeric displays.

Power Supplies (V): 1.5/5.5, 2.2/6.5

Wide voltage supply range ensures compatibility with various power sources, providing flexibility in design and application.

No. of Backplanes: 18-BP

With 18 backplanes, this IC supports complex display configurations, enabling intricate designs and more information to be presented.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in demanding environments, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold temperatures enhances reliability and performance in applications subjected to harsh conditions.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring robust performance and durability in challenging environments.

Technology: CMOS

CMOS technology facilitates low power consumption and high-speed operation, keeping the device more efficient and enhancing battery life.

No. of Segments: 80

With the capability to drive up to 80 segments, this IC is versatile for complex displays, catering to a variety of applications from simple indicators to advanced information displays.

Technical Specifications

Other Function Interface ICs PCF2119RU/2/F2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

18-BP

No. of Segments:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.5/5.5,2.2/6.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF2119RU/2/F2Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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