Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2119FU/2/F2Z by NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V and supports up to 80 segments across 18 backplanes, functioning in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it ensures reliable performance in demanding environments.
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The SEGMENT display mode allows for clear and efficient representation of data, making it a great choice for various display applications.
With a wide input voltage range, this product is versatile and can be powered by various supply systems, enhancing its usability across different applications.
An 18 backplane configuration supports complex display setups, making it ideal for applications requiring multiple connections.
Capable of operating at high temperatures, this product is suitable for demanding environments, ensuring reliability in industrial applications.
The ability to function in extremely low temperatures makes this product perfect for outdoor and harsh environment applications.
Designed for industrial applications, this product ensures durability and long-term performance even in challenging conditions.
CMOS technology offers low power consumption and high-speed operation, making this product efficient and effective for various interfacing needs.
With 80 segments available, this product provides ample flexibility for complex visual representations, allowing for sophisticated display designs.
Other Function Interface ICs PCF2119FU/2/F2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Display Mode:
No. of Backplanes:
No. of Segments:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Equivalence Code:
Power Supplies (V):
Qualification:
Sub-Category:
Technology:
Temperature Grade:
PCF2119FU/2/F2Z Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
1554216002
Molex
WIRE AND CABLE;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Infineon Technologies
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
PCA9517ADP-T
NXP Semiconductors
PCA9517ADP-T by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small outline package style, operates b/w -40°C to 85°C, and has a terminal pitch of 0.65mm for surface mount assembly.
ISO7731BDW
Texas Instruments
ISO7731BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it offers 3 channels and features a small outline package style for surface mount assembly.
ADUM1201CRZ-RL7
Analog Devices
ADUM1201CRZ-RL7 by Analog Devices is a dual-function interface IC with a supply voltage range of 2.7V to 5.5V, suitable for industrial applications. It comes in a small outline package with 8 terminals and operates b/w -40°C to 105°C. The technology used is CMOS, making it ideal for various interface circuit requirements.
TXB0102DCUR
TXB0102DCUR by Texas Instruments is an 8-terminal interface IC with a max supply voltage of 3.6V and operating temperature range of -40 to 85°C. It features a small outline package style, matte tin terminal finish, and Gull Wing terminal form. Ideal for applications requiring a 2-bit output with 3-STATE characteristics in industrial settings.
DS2484Q+T
DS2484Q+T by Analog Devices is an interface IC with 8 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.71V to 5.25V and peak reflow temp of 260C. Widely used in industrial applications requiring small outline, heat sink package style for efficient data interfacing.
ADUM2401ARWZ-RL
ADUM2401ARWZ-RL by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 105 °C. It has a supply voltage range of 2.7V to 5.5V and comes in a small outline package suitable for industrial applications requiring reliable signal isolation.
ADUM141E0BRQZ-RL7
ADUM141E0BRQZ-RL7 by Analog Devices is a digital isolator with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 1.7V to 5.5V and comes in a small outline package suitable for automotive applications. With dual terminals and CMOS technology, it offers reliable performance in various electronic systems.
P82B96DP
Philips Semiconductors
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;
PCA9306FMUTCG
PCA9306FMUTCG by Onsemi is an 8-terminal IC with a temp range of -55 to 125°C. It features a small outline package style, nickel palladium gold finish, and dual terminal position. Ideal for military-grade interface circuits in applications requiring precise temperature control.
SI8662BD-B-IS
Silicon Labs
Silicon Labs' SI8662BD-B-IS is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, GULL WING terminal form, and small outline package style suitable for high-temperature environments up to 125°C.
ISO7762FDBQ
ISO7762FDBQ by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125°C. It has a supply voltage range of 2.25-5.5V and uses CMOS technology. This interface circuit in a small outline package is ideal for military-grade applications requiring high reliability and dual terminal positions.
ISO7231CDW
ISO7231CDW by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -40 to 125 °C. It has a supply voltage range of 3.3V to 5V and is ideal for automotive applications due to its CMOS technology and nickel palladium gold finish. The small outline package measures 10.3mm x 7.5mm with a seated height of 2.65mm, making it suitable for surface mount designs in various electronic systems.
MAX4896ATP+T
MAX4896ATP+T by Analog Devices is a BICMOS technology interface IC with 8-bit driver. It operates b/w -40 to 85°C, with supply voltage range of 2.7-5.5V. Suitable for industrial applications requiring very thin profile and low output current (0.0001A).
SI8641AB-B-IS1R
SI8641AB-B-IS1R by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.5V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, GULL WING terminal form, and small outline package style suitable for surface mount assembly in harsh environments up to 125°C.
PCA9306USG
PCA9306USG by Onsemi is a small outline interface IC with 8 terminals. It operates b/w -55 to 125°C, making it suitable for military-grade applications. The package is rectangular, surface-mountable, and has a terminal pitch of 0.5mm.
ISO7731FQDWRQ1
ISO7731FQDWRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 3 functions, operating at -40 to 125°C. It has a supply voltage range of 2.25-5.5V and features a small outline package suitable for automotive applications. The CMOS technology, GULL WING terminals, and nickel/palladium/gold finish make it ideal for various automotive interface circuit designs.
MAX3378EEUD-T
Maxim Integrated
MAX3378EEUD-T by Maxim Integrated is a 4-function interface IC with supply voltage range of 1.65V to 5.5V. It features small outline package style, dual terminal position, and industrial temperature grade suitable for various applications in electronics requiring interface circuitry.
MAX253CSA+T
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SI8641BD-B-IS2R
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP16,.4;
SN6505DQDBVTQ1
SN6505DQDBVTQ1 by Texas Instruments is a small outline, low profile interface IC with 6 terminals and 1.5A output current. Operating b/w -40 to 125°C, it's AEC-Q100 compliant for automotive applications. With a supply voltage range of 2.25V to 5.5V, it's ideal for various function interface requirements in automotive electronics.
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PCF2112CT
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2113DH/4
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2119AU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119DU/2/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 1.5/5.5,2.2/6.5; No. of Segments: 80; No. of Backplanes: 18-BP; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2DB/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 80; No. of Backplanes: 18-BP; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2111PN
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
PCF2114AU
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 60; Package Equivalence Code: DIE OR CHIP; Technology: CMOS; No. of Backplanes: 32-BP;
PCF2114AU/12
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 3/5; Display Mode: SEGMENT; No. of Backplanes: 32-BP; Qualification: Not Qualified;
PCF2116AU/10
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 3/5; No. of Backplanes: 32-BP; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2116KH/KHZ
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2119RU/2
Other Interface ICs; Temperature Grade: OTHER; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
PCF2119SU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Segments: 80; Maximum Operating Temperature: 85 Cel;
PCF2119VU/2
Other Interface ICs; Temperature Grade: OTHER; Power Supplies (V): 1.5/5.5,2.2/6.5; Qualification: Not Qualified; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119AU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Minimum Operating Temperature: -40 Cel; No. of Segments: 80; Power Supplies (V): 1.5/5.5,2.2/6.5; Package Equivalence Code: DIE OR CHIP;
PCF2119DU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5;
PCF2119FU/2
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; No. of Backplanes: 18-BP; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel;
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