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PCF2119FU/2/F2Z

NXP Semiconductors

PCF2119FU/2/F2Z by NXP Semiconductors

PCF2119FU/2/F2Z by NXP Semiconductors is a CMOS interface IC designed for segment display applications. It operates within a power supply range of 1.5-6.5V and supports up to 80 segments across 18 backplanes, functioning in extreme temperatures from -40 °C to 85 °C. Ideal for industrial use, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,433 parts In-Stock

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Digiode

USA . 3,549 parts In-Stock

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3,549

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Anansix

USA . 2,318 parts In-Stock

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2,318

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Microchip USA

USA . 265 parts In-Stock

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$3.450

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265

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One Stop Electronics

USA . 1,062 parts In-Stock

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$7.500

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$7.500

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AZTECH Wire

Italy . 625 parts In-Stock

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$17.690

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UNI Independent Distributors

Spain . 7,035 parts In-Stock

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Corphita

USA . 2,837 parts In-Stock

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Vigor

Singapore . 128 parts In-Stock

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Overview

Elevate your designs with the PCF2119FU/2/F2Z from NXP Semiconductors, a leader in innovation and quality. This versatile interface IC offers robust performance for segment displays, ensuring reliability across diverse applications even in extreme temperatures. Benefit from its low power consumption and impressive operational range, making it ideal for industrial settings. Choose NXP for unparalleled value and peace of mind in your next project.

Feature Benefit Bullets

Display Mode: SEGMENT

The SEGMENT display mode allows for clear and efficient representation of data, making it a great choice for various display applications.

Power Supplies (V): 1.5/5.5, 2.2/6.5

With a wide input voltage range, this product is versatile and can be powered by various supply systems, enhancing its usability across different applications.

No. of Backplanes: 18-BP

An 18 backplane configuration supports complex display setups, making it ideal for applications requiring multiple connections.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, this product is suitable for demanding environments, ensuring reliability in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures makes this product perfect for outdoor and harsh environment applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product ensures durability and long-term performance even in challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this product efficient and effective for various interfacing needs.

No. of Segments: 80

With 80 segments available, this product provides ample flexibility for complex visual representations, allowing for sophisticated display designs.

Technical Specifications

Other Function Interface ICs PCF2119FU/2/F2Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

18-BP

No. of Segments:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.5/5.5,2.2/6.5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF2119FU/2/F2Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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