Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PCF2113DH/4 by NXP Semiconductors is a CMOS interface IC designed for segment displays, featuring 60 segments and operating b/w -40 °C to 85 °C. It supports power supplies from 1.8V to 6.5V and comes in a flatpack with 100 terminals. Ideal for industrial applications, it ensures reliable performance in various environments.
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Vyrian
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Corphita
Perfect Parts
The use of plastic/epoxy material enhances the durability and reliability of the product, making it suitable for various environments.
The segment display mode provides clear readability, making the device ideal for applications where visual output is crucial.
Being surface mount compatible makes installation easier and allows for compact designs, benefiting modern electronics.
The square package shape optimizes space on PCBs, facilitating better layout and integration into devices.
The wide range of power supply options makes this IC versatile for different applications, allowing for flexibility in design.
With 100 terminals, this IC can accommodate complex functionalities and features, making it suitable for advanced applications.
The flatpack package style contributes to a low profile, allowing for integration into space-constrained environments.
Having 18 backplanes enhances the capabilities of the IC, allowing for more intricate and connected architectures.
The high maximum operating temperature ensures the product can function reliably in demanding conditions.
A minimum operating temperature of -40 °C allows for use in harsh environments, making it a good choice for industrial applications.
Quad terminal positioning enhances connectivity options and simplifies layout in circuit designs.
Rated for industrial temperature grading, this IC is built to withstand rigorous environments, ensuring dependable performance.
The use of CMOS technology provides low power consumption and high-speed operation, making it efficient for modern applications.
Gull wing terminal form enables easy soldering and improves reliability in connection, enhancing overall product quality.
With 60 segments, this IC can provide detailed information on displays, enhancing user interaction and experience.
The fine terminal pitch of 0.5 mm allows for compact designs and increased terminal density, optimizing PCB space usage.
Other Function Interface ICs PCF2113DH/4 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
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PCF2113DH/4 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-T1-E3
Vishay Intertechnology
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
Philips Components
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
BAV99-7-F
Multicomp Pro
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Micro Commercial Components
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
PIC18F4550-I/ML
Microchip Technology
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
General Semiconductor
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
PCA9306USG
PCA9306USG by Onsemi is a small outline interface IC with 8 terminals. It operates b/w -55 to 125°C, making it suitable for military-grade applications. The package is rectangular, surface-mountable, and has a terminal pitch of 0.5mm.
MAX3378EEUD+T
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
253
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; No. of Terminals: 22; Nominal Supply Voltage: 5 V; Package Equivalence Code: FL22,.4; Package Body Material: PLASTIC/EPOXY;
ISO7241CDWR
ISO7241CDWR by Texas Instruments is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125°C, suitable for automotive applications. With CMOS technology and nickel palladium gold finish, it supports a supply voltage range of 3.3V to 5V.
CY8CMBR3108-LQXIT
Infineon Technologies
CY8CMBR3108-LQXIT by Infineon operates at 1.8-5.5V with a temp range of -40 to 85°C. It's a CMOS interface IC with 16 terminals in a square package, suitable for industrial applications requiring precise touch sensing capabilities. The chip carrier design ensures a low profile and easy surface mounting, making it ideal for compact electronic devices.
SI8641BD-B-IS2
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP16,.4;
SI8641AB-B-IS1R
Silicon Labs
SI8641AB-B-IS1R by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.5V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, GULL WING terminal form, and small outline package style suitable for surface mount assembly in harsh environments up to 125°C.
FXLP34P5X
FXLP34P5X by Onsemi is a CMOS interface IC with 5 terminals and a supply voltage range of 1V to 3.6V. It operates in industrial temperature grades from -40°C to 85°C, making it suitable for various applications requiring small outline, thin profile packages such as IoT devices and consumer electronics. With matte tin terminal finish and dual position, this IC offers reliable performance in compact designs.
PCA9306DCUT
PCA9306DCUT by Texas Instruments is a dual-function interface IC with 2 bits. It operates b/w -40 to 85 °C, with a supply voltage range of 0-5.5 V. Ideal for applications requiring open-drain output characteristics in industrial settings.
PCA9306DCUTE4
PCA9306DCUTE4 by Texas Instruments is an interface IC with 2 functions. It operates b/w 1.2V to 5.5V, suitable for industrial applications. With a small outline and thin profile, it has a terminal pitch of 0.5mm and can withstand temperatures from -40°C to 85°C.
ISO7762DW
ISO7762DW by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. This interface circuit in a small outline package is ideal for military-grade applications requiring high reliability and dual terminal positions.
SI8641BA-B-IU
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SSOP16,.25;
MAX253CSA+
INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ADUM3400BRWZ
Analog Devices
ADUM3400BRWZ by Analog Devices is a 16-terminal interface IC with CMOS technology. It features a small outline rectangular package, matte tin terminal finish, and dual terminal position. Ideal for industrial applications requiring surface mount components with a peak reflow temperature of 260°C.
750-362
Wago
The Wago 750-362 is a DIGITAL I/O MODULE with 1 function, operating b/w 0-55 °C. It has a supply voltage range of 18-31.2 V and nominal voltage of 24 V. Ideal for applications requiring MICROELECTRONIC ASSEMBLY in Other Function Interface ICs category.
MAX7301AAI+
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
PCA9600DP
NXP Semiconductors
PCA9600DP by NXP Semiconductors is a small outline, thin profile interface IC with 8 terminals. It operates at a supply voltage range of 2.5V to 15V and has a max supply current of 7.3mA. This bus buffer is commonly used in industrial applications for signal amplification and level shifting.
ISO7242CDWR
ISO7242CDWR by Texas Instruments is a 16-terminal digital isolator with 4 functions, operating at -40 to 125 °C. It features CMOS technology, GULL WING terminals, and a small outline package for automotive applications. With a supply voltage range of 3.3V to 5V, it offers high reliability in surface-mount designs.
NCP1094MNRG
NCP1094MNRG by Onsemi is a small outline, heat sink interface IC with 10 terminals. It operates b/w -40 to 85°C and supports a max supply voltage of 57V. Ideal for industrial applications requiring very thin profile components.
MAX13035EETE+T
MAX13035EETE+T by Analog Devices is a 16-terminal interface IC with BICMOS technology. It operates b/w -40 to 85 °C, with supply voltages of 1.62-3.6 V. Ideal for industrial applications requiring a compact chip carrier package style and matte tin terminal finish.
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PCF2112CT
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCF2112TD
PCF2119AU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119DU/2/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Power Supplies (V): 1.5/5.5,2.2/6.5; No. of Segments: 80; No. of Backplanes: 18-BP; Maximum Operating Temperature: 85 Cel;
PCF2119FU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Technology: CMOS; Minimum Operating Temperature: -40 Cel; Power Supplies (V): 1.5/5.5,2.2/6.5; Maximum Operating Temperature: 85 Cel;
PCF2119IU/2DA/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; No. of Backplanes: 18-BP; Qualification: Not Qualified; Technology: CMOS;
PCF2119RU/2DB/2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Segments: 80; No. of Backplanes: 18-BP; Power Supplies (V): 1.5/5.5,2.2/6.5; Minimum Operating Temperature: -40 Cel;
PCF2119RU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Technology: CMOS; No. of Backplanes: 18-BP; No. of Segments: 80;
PCF2119SU/2/F2Z
Other Interface ICs; Temperature Grade: INDUSTRIAL; No. of Backplanes: 18-BP; Technology: CMOS; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
PCF2113AH
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE;
PCF2113DH
PCF2113DH/F2
PCF2113EH
PCF2114CH
Other Interface ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR;
PCF2114GH
PCF2116AHZ
PCF2116CH
PCF2116GH
PCF2116KH/KHZ
PCF2113DH/F4
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